Backlight Circuit Board Orientation Marks and Dust Occlusion
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Solution Overview
Problem
Existing backlight devices for liquid crystal display devices face challenges such as inefficient luminance uniformity, high power consumption, heat issues, and dust ingress due to complex manufacturing processes and design flaws, particularly with the use of CCFLs, which hinder thinness and control precision, and LED devices struggle with orientation confirmation and light leakage.
Innovation Solution
A backlight device design featuring a circuit board with concave or convex marks for orientation confirmation, a reflection sheet with identification features to prevent erroneous attachment of support pins and rivets, and a substrate that occludes through holes to prevent dust and light leakage, ensuring stable and uniform light application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If CCFLs are used in backlight devices, then high voltage components are required which maintain long insulating distance, but this hinders longitudinal thickness reduction
Solution Approach 1:
The patent extracts and removes high voltage components (inverter circuit board, electrodes) from the backlight device structure by transitioning from CCFL to LED technology. This elimination of high voltage components allows the insulating distance requirement to be removed, thereby enabling significant reduction in the longitudinal thickness of the backlight device while maintaining electrical safety and reliability.
Solution Approach 2:
The patent adopts LED technology which uses low voltage components with no insulating distance requirements, replacing the expensive and bulky high voltage CCFL system. This substitution enables a more compact, thinner design while reducing overall device complexity and cost.
2Ease of manufacture
If circuit boards are attached without orientation marks, then attachment process is simple, but orientation confirmation becomes difficult leading to errors
Solution Approach 1:
The patent applies visual orientation marks (concave or convex features) on the circuit board that provide clear directional indication during assembly. These marks enable workers to quickly and accurately confirm the correct orientation of the circuit board before attachment, preventing assembly errors while maintaining a simple attachment process. The marks serve as visual guides without complicating the manufacturing procedure.
3Ease of manufacture
If through holes are left open in substrate, then manufacturing is simpler, but dust ingress and light leakage occur
Solution Approach 1:
The patent implements occlusion of through holes in the substrate as a preliminary protective measure during and after assembly. By closing these holes with appropriate materials or structures, the design prevents dust ingress and light leakage that would otherwise occur through the through holes, while the occlusion method itself is integrated into the manufacturing process to minimize additional complexity.
Solution Approach 2:
The patent converts the potentially harmful through holes (which allow dust ingress and light leakage) into beneficial sealed structures. The occlusion of through holes transforms what would be defect pathways into protected features, ensuring clean internal environments and proper light containment while maintaining manufacturing feasibility.
4Productivity
If support pins and rivets are attached without identification features, then attachment process is faster, but erroneous attachment occurs reducing reliability
Solution Approach 1:
The patent introduces identification features (such as different head shapes, sizes, or visual markers) on support pins and rivets that enable workers to quickly distinguish between different types and correct attachment locations. These identification features allow for rapid visual confirmation during assembly, preventing erroneous attachment while maintaining high attachment speed. The features serve as visual guides that do not significantly slow down the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances workability in attaching circuit boards, prevents dust and light leakage, maintains uniform luminance, and reduces power consumption, leading to improved display quality and longevity.
Implementation Method 1
a light-emitting diode B1 that emits light along an optical axis in a specific direction
Implementation Method 2
a lens B2 that diffuses light emitted from the light-emitting diode B1
Implementation Method 3
a reflection sheet B5 that reflects light applied from the light-emitting element
Data Source
AI summary
Concave marks indicative of an orientation of a circuit board are formed on the circuit board, convex indices to be engaged with the marks are formed in a position in which the circuit is to be attached. An operator confirms the orientation of the circuit board easily and accurately by visually recognizing the marks and touching the marks with a finger. Moreover, the operator positions the circuit board by engaging the marks with the indices.