Backlight Circuit Heat Emission via Layered Thermal Conduction
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Solution Overview
Problem
Existing display devices, particularly LCDs, face challenges in efficiently emitting heat generated by the backlight unit without increasing the device's size, as conventional mechanical heat emitting solutions are inconvenient and enlarge the bezel.
Innovation Solution
A circuit device with a heat emitting unit, composed of multiple layers including insulating and metal layers, is integrated into the backlight unit to effectively direct heat generated from the light source unit outside the device, reducing the size of the bezel and enhancing heat emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If mechanical heat emitting means are installed in the backlight unit, then heat emission function is improved, but device complexity and ease of manufacture deteriorate due to installation inconvenience and mechanical features
Solution Approach 1:
The patent combines the heat emitting function with the circuit device by integrating a heat emitting unit directly into the circuit board structure. This merging eliminates the need for separate mechanical heat emitting components and their complex installation, while maintaining effective heat emission capability through the integrated design.
Solution Approach 2:
The patent replaces mechanical heat emitting means with an integrated circuit-based heat emitting unit. This substitution eliminates mechanical features and installation complexity by using electrical and thermal integration within the circuit device itself, achieving heat emission through non-mechanical means.
2Temperature
If mechanical heat emitting means are installed, then heat emission capability is improved, but ease of manufacture deteriorates due to many disadvantages from mechanical features
Solution Approach 1:
By merging the heat emitting function into the circuit device structure, the patent eliminates the need for separate manufacturing processes for mechanical heat emitting components. The integrated design allows for streamlined manufacturing where the heat emitting unit is formed as part of the circuit board assembly, improving ease of manufacture.
3Temperature
If heat emitting device is added to emit heat from display panel, then heat emission is improved, but length of display device increases due to enlarged bezel size
Solution Approach 1:
The patent merges the heat emitting function with the existing circuit device within the display panel structure. By integrating the heat emitting unit into the circuit board rather than adding separate components in the bezel area, the design achieves effective heat emission without increasing the overall device dimensions or bezel size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient heat emission and reduction in the size of the display device by integrating a heat emitting unit with multiple layers, ensuring effective heat transfer and maintaining a slim design while preventing damage to the light source and circuit units.
Implementation Method 1
a circuit device to which a heat emitting unit providing a heat emitting function is connected to emit heat generated from the circuit device controlling a light source unit to the outside
Data Source
AI summary
There are provided a circuit device for emitting heat to the outside and a backlight unit including the same. The present invention relates to a display device, a backlight unit connected to a display panel, or a constituent element thereof. The circuit device generates heat, and one or more heat emitting units for emitting heat generated from the light source of the backlight unit to the outside are added to the circuit device, and the backlight unit controlled by the aforementioned circuit device is provided. Each of the heat emitting units according to one embodiment of the present invention includes two or more different material layers to fix the circuit device and provide a heat emitting/directing function.