Backlight Assembly Copper Layer Heat Dissipation
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Solution Overview
Problem
Conventional liquid crystal display (LCD) backlight assemblies have low heat dissipating efficiency due to the lengthy heat-conductive path, which affects the lifespan and light efficiency of the light source.
Innovation Solution
A backlight assembly with a conductive copper layer connecting the light source directly to a heat sink through a bent metallic printed circuit board, accompanied by a dielectric layer and an insulating paint-coated heat sink to enhance heat dissipation, reducing the heat-conductive path and improving thermal radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the conventional heat conductive path through dielectric layer and heat-conductive glue is used, then the light source can be mounted on the backlight assembly, but the heat dissipating efficiency is low
Solution Approach 1:
The patent extracts and removes the dielectric layer and heat-conductive glue from the heat conductive path. By directly mounting the light source on the metallic printed circuit board with high thermal conductivity, the patent eliminates the thermal resistance introduced by these intermediate layers, thereby significantly improving heat dissipating efficiency while simplifying the heat conductive path structure
Solution Approach 2:
The patent changes the thermal conductivity parameter of the heat conductive path by using a metallic printed circuit board instead of conventional non-metallic materials. This parameter change enables direct and efficient heat transfer from the light source to the heat sink, resolving the contradiction between maintaining structural integrity and improving heat dissipation
2Duration of action of stationary object
If the heat is not dissipated timely through the conventional path, then the light source can operate continuously, but the lifespan and light efficiency of the light source are decreased
Solution Approach 1:
The patent introduces a metallic printed circuit board as an intermediary with high thermal conductivity between the light source and the heat sink. This intermediary efficiently transfers heat away from the light source, preventing heat accumulation that would otherwise reduce lifespan and light efficiency, while allowing continuous operation
Solution Approach 2:
The patent replaces the conventional mechanical mounting method (using dielectric layers and adhesive) with a thermally conductive metallic printed circuit board that simultaneously provides both mechanical support and efficient heat dissipation, thereby protecting the light source from thermal damage and extending its lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances heat dissipation efficiency, ensuring better light source performance and longevity while maintaining a narrow frame design for LCDs.
Implementation Method 1
The heat from a light source on the light bar is conducted sequentially through a copper layer, a dielectric layer, a metallic printed circuit, a heat-conductive glue, the heat sink and the back plate finally to an external environment
Implementation Method 2
the heat sink and the back plate finally to an external environment
Data Source
AI summary
A backlight assembly and an LCD using the same are provided. The backlight assembly comprises: a light source, a conductive copper layer, a dielectric layer, a metallic printed circuit board and a heat sink. The dielectric layer is attached to one side surface of the metallic printed circuit board. The conductive copper layer is mounted on the dielectric layer. The light source and the heat sink are respectively connected to the conductive copper layer. The light source utilizes the conductive copper layer to conduct electricity and to conduct the heat to the heat sink. The backlight assembly has the heat sink connecting to the light source through the conductive copper layer to shorten the heat dissipating path of the light source and to enhance the heat-dissipating efficiency of the light source. Moreover, for the narrow frame, the heat sink is directly welded to the bent metallic printed circuit board.