Backlight Device Drive Substrate Integration
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Solution Overview
Problem
The existing backlight devices for liquid crystal displays face challenges in reducing thickness and part count due to the separation of light source and drive substrates, which increases heat generation and requires longer wiring, leading to noisy control signals and increased component count.
Innovation Solution
A backlight device design where drive substrates are mounted on the other surface side of a reflector on the bottom chassis, allowing for direct electrical connection through short connectors, reducing the need for external wiring and heat radiating components, and integrating the drive substrates within the chassis to decrease thickness and part count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If drive substrates are mounted on the outside of the bottom chassis, then heat radiation space is sufficient, but the thickness of the backlight device increases
Solution Approach 1:
The drive substrates are mounted on the same bottom chassis as the light source substrates, merging the drive function with the light source assembly rather than separating them. This integration eliminates the need for additional space outside the chassis, thereby reducing overall thickness while maintaining heat radiation capability through the chassis structure.
Solution Approach 2:
The patent utilizes the vertical dimension and lateral space within the bottom chassis to mount drive substrates, rather than extending outward in the thickness direction. By arranging components in the planar dimension of the chassis, the solution achieves sufficient heat radiation area without increasing device thickness.
2Temperature
If drive substrates are mounted on the outside of the bottom chassis, then heat radiation is improved, but the number of parts increases
Solution Approach 1:
The drive substrates are integrated onto the same bottom chassis as the light source substrates, merging multiple functions (light emission and drive control) into a single assembly. This reduces the total number of separate parts and simplifies the overall structure compared to having separate mounting locations for drive substrates.
Solution Approach 2:
The bottom chassis serves multiple functions: it supports light source substrates, provides heat radiation pathways, and now also mounts drive substrates. This multi-functionality eliminates the need for separate dedicated mounting structures, reducing part count while maintaining thermal management capabilities.
3Reliability
If wiring members have longer wires to connect light source substrates and drive substrates, then electrical connection is achieved, but control signals become noisy
Solution Approach 1:
By mounting both light source substrates and drive substrates on the same bottom chassis, the patent minimizes the distance between them. This shortens the wiring length required for electrical connection, thereby reducing electromagnetic interference and noise in control signals while maintaining reliable electrical connectivity.
4Reliability
If wiring members have longer wires, then electrical connection between light source substrates and drive substrates is achieved, but the number of parts increases
Solution Approach 1:
The integration of drive substrates and light source substrates on the same bottom chassis eliminates the need for external connectors and long wiring harnesses. This merging of components reduces the number of discrete parts while ensuring reliable electrical connection through short, integrated wiring paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the thickness and part count of the backlight device, minimizes noise in control signals, and enhances electromagnetic wave resistance by eliminating unnecessary radiation and mutual interference between components.
Implementation Method 1
a reflector reflecting the illumination light irradiated from the light emitting devices
Implementation Method 2
a diffuser facing the one surface side of the reflector through a predetermined facing interval from the reflector and internally diffusing the illumination light incident from the reflector
Data Source
AI summary
A backlight device that illuminates a transmissive liquid crystal panel is disclosed. The device includes: a plurality of light source substrates on which a plurality of light emitting devices irradiating illumination light are mounted; drive substrates having drive circuits for the light emitting devices and electrically connected to the light source substrates; a bottom chassis having one surface to which the plurality of light source substrates are attached; a reflector having openings corresponding to the light emitting devices and through which the light emitting devices are exposed, and reflecting the illumination light; a diffuser facing the one surface side of the reflector through a predetermined facing interval and internally diffusing the illumination light; and an optical function sheet laminate combined with the diffuser on one surface side thereof, containing a stack of a plurality of optical function sheets and guiding the illumination light to the liquid crystal panel.