Dual-Package Backlight Module for Light Conversion Heat Dissipation
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Solution Overview
Problem
Existing display devices with non-emissive panels face issues with heat dissipation from light conversion units, leading to reduced light efficiency and potential damage to the light source package due to high heat and gas volatilization.
Innovation Solution
A display device structure featuring a light source package with a transparent member surrounded by a first package and a second package, where the second package has higher thermal conductivity than the first, and includes a metal material to efficiently dissipate heat away from the light conversion member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a light conversion unit is provided in the backlight unit to convert properties of light generated from the light source, then light efficiency is improved, but heat is generated causing the light source module to malfunction
Solution Approach 1:
The light source module is divided into separate functional components: the light source, the light conversion member, the transparent member, and dual packaging layers (first and second packages). This segmentation allows heat generated during light conversion to be isolated and managed separately from the light source, preventing thermal damage while maintaining conversion efficiency.
Solution Approach 2:
The transparent member acts as an intermediary between the light source and the light conversion member, allowing light to pass through while providing thermal isolation. The first and second packages serve as intermediate thermal management layers, with the second package having higher thermal conductivity to efficiently conduct heat away from the conversion unit.
2Device complexity
If the light conversion member is surrounded by a single package, then device complexity is reduced, but heat dissipation efficiency is insufficient causing damage to the light source package
Solution Approach 1:
The packaging structure is segmented into two distinct layers: the first package surrounding the light source and transparent member, and the second package surrounding the first package. This dual-layer segmentation enables differentiated thermal management, with the second package providing enhanced heat dissipation capability while the first package provides immediate protection.
Solution Approach 2:
The packaging system uses composite material principles by combining materials with different thermal conductivities in the first and second packages. The second package is specifically designed with higher thermal conductivity material to create a composite thermal management system that efficiently conducts heat away from the light conversion unit while protecting the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, preventing damage to the light source package and maintaining light efficiency by effectively removing heat and volatile gases, thereby enhancing the reliability of the display device.
Implementation Method 1
a thermal conductivity of the second package is greater than a thermal conductivity of the first package
Data Source
AI summary
A display device according to an example embodiment comprises: a light source package comprising light sources disposed on the mounting surface of a printed circuit board and a display panel and configured to irradiate light toward the display panel. The light source package comprises: a light conversion member configured to convert the wavelength of the light emitted from the light sources; a transparent member configured to transmit the light emitted from the light sources, and to support the light conversion member; a first package substantially surrounding the light sources and the transparent member; and a second package covering the outside of the first package, wherein the thermal conductivity of the second package is greater than the thermal conductivity of the first package.