Backlight Frame Heat Dissipation Channels

Solution Overview

Problem

Existing backlight modules face inefficiencies in heat dissipation, leading to increased thickness, obstructed thinning, and higher fabrication costs due to embedded or adhesively attached cooling fins, which also result in low heat dissipation efficiency and accelerated aging of light emitting elements.

Innovation Solution

Incorporating heat dissipation channels within the frame of the backlight device, specifically at the periphery of grooves securing light emitting elements, allowing for direct and rapid thermal radiation dissipation without additional cooling fins or adhesive processes, thus enhancing heat exchange with outside air.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling fins are embedded into or adhesively attached to the backlight module, then heat dissipation is achieved, but the thickness of the backlight module increases

Engineering Contradiction:

Improveheat dissipationVSAvoidthickness of backlight module

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The cooling fin structure is merged with the frame structure to form an integrated component. The frame body itself is designed with heat dissipation channels and protrusions that serve dual purposes as both structural support and thermal management features, eliminating the need for separate cooling fin components and reducing overall module thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The frame is designed to perform multiple functions simultaneously: it provides structural support for the light emitting elements, serves as a heat dissipation pathway through integrated channels, and acts as a mounting structure. This multi-functionality eliminates the need for dedicated cooling fins and reduces the number of components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If cooling fins are embedded into or adhesively attached to the backlight module, then heat dissipation is achieved, but fabrication cost increases due to additional processes

Engineering Contradiction:

Improveheat dissipationVSAvoidfabrication cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling fin structure is merged with the frame structure to form an integrated component. The frame body itself is designed with heat dissipation channels and protrusions that serve dual purposes as both structural support and thermal management features, eliminating the need for separate cooling fin components and reducing overall module thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The frame is designed to perform multiple functions simultaneously: it provides structural support for the light emitting elements, serves as a heat dissipation pathway through integrated channels, and acts as a mounting structure. This multi-functionality eliminates the need for dedicated cooling fins and reduces the number of components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If cooling fins are embedded into or adhesively attached to the backlight module, then heat dissipation is achieved, but heat dissipation efficiency is low

Engineering Contradiction:

Improveheat dissipationVSAvoidheat dissipation efficiency

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The heat dissipation design transitions from two-dimensional fin surfaces to three-dimensional channels with through-holes that extend through the frame thickness. This dimensional change creates multiple heat dissipation pathways and increases the effective heat exchange area with the surrounding environment.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The frame incorporates through-holes and channels that create a porous-like structure for heat dissipation. These openings allow air flow through the frame rather than just across the surface, significantly enhancing convective heat transfer efficiency.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves heat dissipation efficiency, reduces the thickness of the backlight module, lowers manufacturing costs, and extends the service life of light emitting elements by effectively managing thermal radiation and hot air exchange.

Implementation Method 1

the light emitting source 12 emits light, the cooling fin 11 absorbs heat radiation from the light emitting source 12

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

the cooling fin 11 absorbs heat radiation from the light emitting source 12 and then dissipates the heat

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

at least one groove configured to secure a light emitting element

Methodology Applied

Scientific EffectMechanical constraint: Mechanical Fastener

Data Source

PatentUS10466410B2Backlight device

Publication Date: 2019.11.05 WUHAN TIANMA MICRO ELECTRONICS CO LTD

AI summary

A backlight device is disclosed. The backlight device includes a reflection sheet; a frame in contact with the reflection sheet; and a light guiding plate surrounded by the frame; wherein the frame comprises: a first surface in contact with the reflection sheet, a second surface spaced apart from the reflection sheet, at least one groove configured to secure a light emitting element, and a heat dissipation channel in at least one of the first surface and the second surface of the frame, wherein the heat dissipation channel is located at periphery of the groove.