Backlight Module Frame Joining via Through-Hole Interference
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Solution Overview
Problem
Conventional backlight modules suffer from insufficient joining strength between the back bezel and the frame, leading to potential peeling and reduced mold lifespan due to the reverse bending structure's limitations in enhancing joining strength in all directions and causing mold scratches.
Innovation Solution
The backlight module incorporates a back bezel with a through hole and reverse bending structure, where the frame extends into the hole to cover the structure, creating structural interference that enhances joining strength in x, y, and z directions, and uses a metal back bezel with an arc top surface covered by the frame to prevent peeling and mold damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a reverse bending structure is added to the back bezel side wall, then the joining strength in z direction is improved, but the overall joining strength in x and y directions remains insufficient
Solution Approach 1:
The patent transitions from a single-dimension (z-direction) reverse bending structure to a multi-dimensional solution by adding through-holes that extend in x and/or y directions. The frame engages with these through-holes to provide joining strength in multiple directions simultaneously, resolving the limitation of the conventional single-direction approach.
Solution Approach 2:
The frame is inserted into the through-holes of the back bezel, creating a nested structure where one component fits within another. This nesting arrangement allows the frame to engage with the back bezel in multiple directions, enhancing overall joining strength while maintaining a compact design.
2Strength
If the back bezel is made of hard and rigid material, then structural strength is improved, but the mold lifespan is reduced due to scratching
Solution Approach 1:
The patent extracts the contact interface between the back bezel and mold by introducing through-holes. The frame material fills these through-holes and contacts the mold instead of the hard back bezel surface, separating the rigid structural component from the mold contact function.
Solution Approach 2:
The frame material acts as an intermediary between the mold and the back bezel. During injection molding, the frame material fills the through-holes and contacts the mold surfaces, preventing direct contact between the mold and the hard back bezel material that would cause scratching.
3Ease of manufacture
If the frame is injected directly onto the back bezel surface, then the manufacturing process is simple, but the joining strength is insufficient
Solution Approach 1:
The patent segments the back bezel side wall by creating through-holes, dividing the continuous surface into distinct regions. This segmentation allows the frame to engage with the back bezel at multiple discrete locations, significantly enhancing joining strength while maintaining a relatively simple injection molding process.
Data Source
AI summary
A backlight module including a back bezel, a frame, and a backlight source is provided. The back bezel has a bottom carrier and a side wall extending upward from an edge of the bottom carrier so as to define a containing space. The side wall has a through hole and a reverse bending structure. The reverse bending structure is bent downward into the containing space for shielding a portion of the through hole. Parts of the region of the back bezel are covered with the frame and a portion of the frame extends from the containing space into the through hole and covers the reverse bending structure. The backlight source is disposed in the containing space located over the back bezel and the frame.