Backlight Module Front Casing Heat Dissipation Design
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Solution Overview
Problem
The existing backlight module for liquid crystal displays has inefficiencies in heat dissipation due to a smaller effective heat-dissipation area and increased thermal contact resistance from multiple interfaces during heat transfer from the light source to the heat dissipation fins and back cover.
Innovation Solution
A backlight module design featuring a front casing with a fin heat-dissipation structure and a buffer component with a honeycomb structure, where the LED light source is directly fixed on the front casing, simplifying heat transmission, reducing thermal contact resistance, and increasing the effective heat-dissipation area, allowing synchronous heat transfer to both the front and back casings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED light source is fixed on the back cover through multiple interfaces (aluminum extrusion, heat dissipation fins, elastic components), then the light source can be securely mounted, but the thermal contact resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent merges the mounting function and heat dissipation function into a single integrated structure. The aluminum alloy clamping assembly directly contacts the LED light source and transfers heat to both the front casing and back casing, eliminating the need for separate heat dissipation fins and reducing the number of thermal interfaces. This integration reduces thermal contact resistance while maintaining secure mounting.
Solution Approach 2:
The patent extracts the heat dissipation function from the traditional back-cover-mounted heat dissipation fins and relocates it to the aluminum alloy clamping assembly that directly contacts the LED light source. This allows heat to be conducted away from the light source through the mounting structure itself, reducing the number of thermal interfaces and improving heat dissipation efficiency.
2Temperature
If aluminum extrusion is used as heat dissipation fins mounted on the back cover, then heat dissipation structure can be formed, but the effective heat-dissipation area contacted with the back cover is smaller
Solution Approach 1:
The patent transitions from single-direction heat dissipation (back cover only) to multi-directional heat dissipation by enabling heat transfer to both the front casing and back casing simultaneously. The aluminum alloy clamping assembly conducts heat from the LED light source to the front casing through its front surface and to the back casing through its rear surface, effectively doubling the heat dissipation pathways and increasing the effective heat-dissipation area.
3Reliability
If multiple interfaces are used for heat transmission from light source to back cover, then secure mounting is achieved, but thermal contact resistance becomes larger
Solution Approach 1:
The patent combines the mounting function and heat dissipation function into a single integrated aluminum alloy clamping assembly. The clamping assembly directly contacts the LED light source, light guide plate, and liquid crystal panel while simultaneously conducting heat to both the front casing and back casing. This eliminates the need for separate heat dissipation fins and reduces the number of thermal interfaces, thereby reducing thermal contact resistance while maintaining secure mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat-dissipation efficiency by reducing thermal contact resistance and increasing the effective heat-dissipation area, ensuring efficient heat transfer and improved buffering performance for the liquid crystal panel.
Implementation Method 1
the heat caused by the LED light source can be synchronously transmitted to the front casing and to the back casing
Implementation Method 2
the buffer component is provided with a honeycomb structure for enhancing the buffering performance of the liquid crystal panel
Data Source
AI summary
The patent application relates to a backlight module and a liquid crystal display. Such backlight module includes a front casing, a back casing and a light source. The front casing includes a first clamping part and a second clamping part externally and vertically extended from the first clamping part. The second clamping part is fixedly connected with the back casing. The light source is positioned between the first clamping part and the back casing, and the back side of the light source is contacted with the inner side face of the second clamping part. The inside of the second clamping part corresponding to the back of the light source is provided with a fin heat-dissipation structure. The patent application directly fixes an LED light source on the front casing of the all-in-one machine of the liquid crystal display, which simplifies the heat transmission way, reduces the thermal contact resistance and increases the effective heat-dissipation area of the front casing Thereby, the heat caused by the LED light source can be synchronously transmitted to the front casing and to the back casing. Besides, the utility model installs a fin heat-dissipation structure on the front casing corresponding to the back of the LED light source, which can improve the heat-dissipation efficiency to a large extent. Moreover, the utility model installs a honeycomb-structured buffer component on the front casing where the liquid crystal panel is clamped for enhancing the buffering performance of the liquid crystal panel.