Backlight Module Groove Structure for Active Mini LED Driving
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Solution Overview
Problem
Mini LED display apparatuses using passive driving mode suffer from low refresh frequency, signal delay, howling, large layout space, high power consumption, wire complexity, assembly difficulties, and structural weakness, leading to issues like flickering, film swelling, and deformation.
Innovation Solution
Implement an active driving mode with a light-emitting substrate, chip-on-film, and backplane structure, featuring a groove design to protect driver chips and enhance structural strength, reduce heat generation, and simplify assembly through a groove design that accommodates chip-on-film components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive driving mode is used in Mini LED display, then device complexity is reduced, but refresh frequency decreases and signal delay increases
Solution Approach 1:
The backlight module is segmented into multiple independently controllable light-emitting units (mini LEDs), with each unit having its own driver chip for active driving. This segmentation enables high refresh frequency by allowing independent control of each unit, while the driver chips are integrated onto the light-emitting substrate to maintain compact structure.
2Speed
If active driving mode is implemented with driver chips, then refresh frequency and signal transmission improve, but device complexity and assembly difficulty increase
Solution Approach 1:
The driver chips are merged with the light-emitting substrate by directly mounting them onto the substrate, integrating the driving function into the existing structure. This merging approach enables active driving mode with high refresh frequency while avoiding the need for separate driver circuits, thus reducing overall device complexity and simplifying assembly.
3Ease of manufacture
If driver chips are mounted on light-emitting substrate, then integration is improved, but heat generation increases
Solution Approach 1:
A heat dissipation layer is introduced as an intermediary between the driver chips and the light-emitting substrate. This heat dissipation layer efficiently conducts away the heat generated by the driver chips, allowing them to be mounted directly on the substrate for integrated manufacturing while preventing excessive temperature rise that would compromise reliability.
4Ease of manufacture
If chip-on-film structure is used without protection, then assembly is simplified, but structural strength and component protection are reduced
Solution Approach 1:
The chip-on-film structure is nested within a protective groove formed on the light-emitting substrate. The groove accommodates the driver chips and provides mechanical protection, while the chip-on-film assembly remains integrated with the substrate. This nested structure maintains assembly simplicity while significantly enhancing structural strength and component protection.
Data Source
AI summary
A backlight module includes a light-emitting substrate, at least one chip-on-film and a backplane. The light-emitting substrate includes a signal line group and a plurality of light-emitting units, and the plurality of light-emitting units are electrically connected to the signal line group. The at least one chip-on-film is arranged on a non-light exit side of the light-emitting substrate, and electrically connected to the signal line group. The backplane is disposed on the non-light exit side of the light-emitting substrate, and the at least one chip-on-film is located between the backplane and the light-emitting substrate. The backplane is provided with a groove therein, a notch of the groove faces the light-emitting substrate, and at least portion of a chip-on-film film of the at least one chip-on-film is disposed in the groove.