Backlight Device with Grooved Optical Adhesive Quantum Dots
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Solution Overview
Problem
Conventional backlight devices face challenges in achieving high color gamut and uniform illumination due to limited color capabilities of LED light sources and complex, costly manufacturing processes, especially when incorporating light emitting quantum dot materials.
Innovation Solution
A backlight device comprising a light guide plate, a reflective layer, an optical adhesive layer with grooves containing light emitting quantum dot material, and an outcoupling structure that allows light to be coupled out, which enhances light utilization and reduces manufacturing complexity by using a simpler processing method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If light emitting quantum dot materials are used to achieve high color gamut backlight, then color gamut is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the quantum dot material with the optical adhesive layer into a single integrated component. The quantum dot material is dispersed within the optical adhesive material, eliminating the need for separate quantum dot layers and complex alignment processes. This merging reduces manufacturing steps while maintaining high color gamut performance.
Solution Approach 2:
The optical adhesive layer serves multiple functions simultaneously: it provides optical adhesion between layers, contains and positions the quantum dot material, and acts as a medium for light transmission. This multi-functionality reduces the number of separate components needed and simplifies the overall device structure.
2Illumination intensity
If multiple diffusion plates and diffusion prisms are stacked to achieve uniform backlight illumination, then illumination uniformity is improved, but device thickness and complexity increase
Solution Approach 1:
The patent introduces localized outcoupling structures at specific positions within the light guide plate rather than using multiple stacked diffusion layers. These outcoupling structures create localized light extraction zones that collectively achieve uniform illumination across the entire backlight surface, reducing the need for thick stacked structures.
Solution Approach 2:
The patent transitions from a vertical stacking approach (multiple plates stacked in the thickness direction) to a planar integration approach (outcoupling structures distributed in the lateral plane within a single light guide plate). This dimensional shift achieves illumination uniformity without increasing device thickness.
3Illumination intensity
If light sources are separated from each layer above them to achieve uniform backlight distribution, then illumination uniformity is improved, but light utilization efficiency decreases
Solution Approach 1:
The patent introduces an outcoupling structure as an intermediary element within the light guide plate that mediates between the light source and the display panel. This structure efficiently extracts light from the light guide plate at controlled positions, achieving uniform illumination while minimizing light loss compared to separating light sources from layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high color gamut backlight illumination with improved light utilization and reduced manufacturing costs, offering a thinner and more efficient backlight device with enhanced light output uniformity.
Implementation Method 1
a light emitting quantum dot material provided within each groove, and configured to receive light from the backlight source and to convert at least a portion of the light received from the backlight source into light of a different wavelength
Implementation Method 2
an outcoupling structure... located on a surface of the light guide plate facing away from the backlight source and configured to allow light to be coupled out from the light guide plate
Implementation Method 3
an optical adhesive layer... located on a surface of the light guide plate facing towards the backlight source
Data Source
AI summary
The present disclosure relates to the field of display technologies, and especially discloses a backlight device and a method for manufacturing the same. The backlight device includes a backlight source, a light guide plate, a reflective layer, an optical adhesive layer and an outcoupling structure. Specifically, in the backlight device, the reflective layer and the light guide plate are located on opposite sides of the backlight source respectively.