Backlight Unit Guide Pattern Alignment
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Solution Overview
Problem
Conventional direct-type backlight units face issues with soldering connections causing short circuits due to excessive voltage applying lines, and the transition to electrode PCBs leads to shape correspondence challenges and potential distortion, resulting in lamp deformation or breakage.
Innovation Solution
A backlight unit design featuring a case structure with printed circuit boards (PCBs) equipped with fastening units and guide patterns to facilitate precise alignment and connection of lamps, minimizing soldering processes and reducing voltage applying lines, while using guide patterns to determine deviation angles and ensure correct positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage applying lines are used to connect lamp electrodes with driving unit, then electrical connection is achieved, but the number of lines increases causing soldering complexity and short circuit risk
Solution Approach 1:
The patent combines multiple voltage applying lines into a single electrode PCB structure. The PCB integrates multiple connection points and conductive paths internally, replacing the need for separate voltage applying lines for each lamp electrode. This merging reduces the overall number of external connections required while maintaining reliable electrical connectivity between the lamp electrodes and the driving unit.
Solution Approach 2:
The electrode PCB serves as an intermediary component between the lamp electrodes and the driving unit. Instead of directly connecting multiple voltage applying lines to each lamp electrode, the PCB acts as a intermediate platform that receives power from the driving unit and distributes it to multiple lamp electrodes through its internal conductive structure, simplifying the external connection architecture.
2Ease of manufacture
If electrode PCB is separately manufactured from lamp, then manufacturing flexibility is improved, but shape correspondence becomes difficult causing distortion and lamp deformation
Solution Approach 1:
The patent incorporates the guide pattern formation into the PCB manufacturing process before the PCB is separately assembled with the lamps. By pre-forming the guide patterns during PCB fabrication, the design ensures that when the PCB is later connected to the lamps, the guide patterns provide accurate alignment references. This preliminary action maintains manufacturing flexibility while ensuring shape correspondence accuracy.
Solution Approach 2:
The guide pattern on the PCB serves as a copied reference from the ideal lamp electrode arrangement. By creating this pattern during PCB manufacturing, it provides a template that ensures the separately manufactured PCB will align correctly with the lamps during assembly, transferring the precise geometric relationships from the design stage through to final assembly.
3Productivity
If lamp connection is performed without alignment guide, then assembly process is simplified, but wrong positioning occurs causing lamp deformation or breakage
Solution Approach 1:
The guide pattern on the PCB provides self-aligning functionality during lamp connection. The pattern acts as a built-in alignment mechanism that guides the lamps into correct positions during assembly, eliminating the need for external alignment tools or complex positioning procedures. This self-service approach maintains fast assembly while ensuring accurate lamp positioning and preventing deformation or breakage.
Data Source
AI summary
Disclosed are a backlight unit capable of determining a deviated degree of a lamp grip by a guide line formed adjacent to the lamp grip a PCB that connects an electrode thereof with a lamp electrode, and a manufacturing method for the same. The manufacturing method includes preparing a case structure, a plurality of lamps equipped with an electrode at both ends, and fastening units corresponded to the electrodes of the lamps, preparing a PCB constituted by a base substrate and a signal line formed on the base substrate, and defined with positions thereon for forming the fastening units having electric connection parts with respect to the signal line, and positioning the PCB in the case structure, forming a solder layer at the electric connection parts on the PCB by applying a soldering material using a solder mask, and forming a guide pattern at both sides of the fastening unit, connecting the fastening units with the solder layers while using the guide patterns as marks, and connecting the lamps to the fastening units.