Backlight Module Heatsink Plate Folded Structure
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Solution Overview
Problem
Current light emitting modules in display devices face challenges in effectively dissipating heat generated by light emitting devices, which can lead to increased temperatures and reduced light efficiency.
Innovation Solution
A light emitting module design featuring a module board with protrusion holes and a heatsink plate with protrusions, where the heatsink frame of the light emitting device connects to the protrusions on the heatsink plate, enhancing heat dissipation through a folded structure that radiates heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink plate is used to dissipate heat from light emitting devices, then heat dissipation capability is improved, but device complexity increases due to the need for protrusion holes and folded structures
Solution Approach 1:
The heatsink plate is segmented into multiple protrusions that are inserted into corresponding protrusion holes in the module board, creating distributed heat dissipation pathways. This segmentation allows heat to be conducted through multiple discrete contact points rather than a single interface, improving thermal management while maintaining a relatively simple overall structure.
Solution Approach 2:
The heatsink plate incorporates a folded structure with a second frame part that extends in a direction perpendicular to the first frame part. This dimensional transformation creates additional heat dissipation surfaces and pathways, enhancing thermal performance without significantly increasing the footprint or overall complexity of the device.
2Temperature
If the heatsink plate uses a folded structure with multiple frame parts, then heat radiation efficiency is improved, but manufacturing difficulty increases
Solution Approach 1:
The folded structure is segmented into a first frame part and a second frame part that are connected at an angle. This segmentation allows each part to be manufactured and then assembled together, reducing the overall manufacturing difficulty compared to creating a single complex folded piece, while still achieving enhanced heat radiation efficiency through the multi-dimensional structure.
3Temperature
If protrusions are inserted into protrusion holes to connect heatsink plate and light emitting devices, then thermal contact is improved, but assembly complexity increases
Solution Approach 1:
The thermal connection is segmented into multiple discrete protrusions that are inserted into corresponding holes in the module board. This segmentation creates multiple localized thermal contact points, improving overall thermal contact between the heatsink plate and the light emitting devices. The modular nature of these protrusions simplifies the assembly process compared to creating large complex contact surfaces.
Solution Approach 2:
The protrusions act as intermediary elements that facilitate thermal contact between the heatsink plate and the module board. Rather than requiring direct large-surface contact, these intermediary protrusions provide reliable thermal pathways, simplifying the assembly process while maintaining effective thermal connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat radiation efficiency, preventing temperature increases in light emitting devices and enhancing light efficiency by effectively dissipating heat, thereby stabilizing the operation and improving the reliability of the light emitting module.
Implementation Method 1
a heatsink plate corresponding to a second surface opposite to the first surface of the module board, the heatsink plate comprising a plurality of protrusions respectively inserted into the protrusion holes of the module board; and a plurality of light emitting devices, each comprising a heatsink frame connected to the protrusions of the heatsink plate
Data Source
Figure 1
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AI summary
Provided are a light emitting module and a backlight unit. The light emitting module comprises a module board comprising a plurality of first and second pads and a plurality of protrusion holes on/in a first surface thereof, a heatsink plate corresponding to a second surface opposite to the first surface of the module board, the heatsink plate comprising a plurality of protrusions respectively inserted into the protrusion holes of the module board, and a plurality of light emitting devices, each comprising a heatsink frame connected to the protrusions of the heatsink plate, the plurality of light emitting devices being connected to the first and second pads of the module board. The heatsink plate comprises a first frame part on which the plurality of protrusions are disposed and a second frame part folded from the first frame part and disposed under the module board.