Backlight Module Integrated Supporting Portion Design
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Solution Overview
Problem
Conventional Mini-LED backlight modules have increased fabrication processes and installation difficulties due to the use of support brackets, which also elevate costs.
Innovation Solution
A backlight module design featuring a backplate with integrated installation and supporting portions, where the supporting portion protrudes along the light exiting direction of the LED lamp board, eliminating the need for a separate support bracket and allowing for reduced fabrication processes and installation complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a support bracket is used to connect adjacent LED lamp boards, then heat dissipation effect is improved, but fabrication processes increase and installation difficulty increases
Solution Approach 1:
The patent integrates the support bracket function into the backplate structure by forming supporting portions directly on the backplate. This merging of functions eliminates the need for separate support brackets, reducing fabrication processes while maintaining heat dissipation effectiveness through direct thermal conduction paths from LED lamp boards to the backplate.
Solution Approach 2:
The backplate is designed to perform multiple functions: structural support, heat dissipation, and positioning of LED lamp boards. The supporting portions formed on the backplate provide both mechanical support and thermal management, eliminating the need for dedicated support brackets and simplifying the overall structure.
2Temperature
If a support bracket is used to connect adjacent LED lamp boards, then heat dissipation effect is improved, but installation difficulty increases
Solution Approach 1:
By integrating the support function into the backplate through formed supporting portions, the patent eliminates separate support bracket components that would require assembly. This reduces installation steps and difficulty while maintaining effective heat dissipation through the integrated structure.
3Strength
If a support bracket is used to connect adjacent LED lamp boards, then structural support is improved, but cost increases
Solution Approach 1:
The patent combines the support bracket function with the backplate by forming supporting portions directly on it. This integration reduces component count and assembly requirements, lowering manufacturing cost while maintaining structural support strength through the monolithic backplate design.
Solution Approach 2:
The backplate serves multiple functions including structural support, heat dissipation, and component positioning. By making the backplate multi-functional, the patent eliminates the need for separate support brackets, reducing material costs and manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces fabrication processes and installation difficulty while maintaining effective heat dissipation and light uniformity, lowering overall costs and improving the manufacturing efficiency of the backlight module.
Implementation Method 1
the supporting portion is directly connected between the adjacent ones of the installation portions... improves a heat dissipation effect
Implementation Method 2
an optical reflection layer is disposed on a surface of a protruding portion of the supporting portion protruding along the light exiting direction of the LED lamp board
Data Source
AI summary
The present application discloses a backlight module and a display device. The present application disposes a supporting portion, configured to support the diffuser plate, on a bottom board of a backplate. The supporting portion needs no connection with a light emitting diode (LED) lamp board. Compared to a conventional backlight module using a structure of a support bracket connected to an LED lamp board, the supporting portion of the present application can be formed during manufacturing the bottom board of the backplate to reduce fabrication processes of the backlight module and lower installation difficulty and a cost.