Backlight Unit Inverter Integration for LCD Noise Reduction
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Solution Overview
Problem
Conventional direct-type backlight units for large-size liquid crystal displays suffer from noise due to vibration and thermal expansion, and have complex and costly assembly processes, as well as increased volume due to external wire connections.
Innovation Solution
The design incorporates a backlight unit with first and second substrates having common electrode patterns connected to lamps, with inverter units positioned on the rear surface of a bottom case, and wires connecting these substrates and inverter units via through holes, simplifying assembly and reducing noise by integrating components on Printed Circuit Boards (PCBs).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sockets and common lines are fixed to molded substrates using individual screws, then assembly is possible, but noise is produced due to vibration and thermal expansion
Solution Approach 1:
The patent merges multiple discrete components (sockets and common lines) into an integrated circuit board assembly. The circuit board serves as a unified substrate that simultaneously provides electrical connections and mechanical support, eliminating the need for separate screw-fixing operations and reducing vibration-induced noise through integrated mounting.
Solution Approach 2:
The patent replaces the mechanical screw-fixing system with an electrical circuit board mounting system. Instead of mechanically fastening sockets and common lines with screws, the electrical connections are established through conductive traces on the circuit board, which also provides structural support, thereby reducing mechanical vibration and noise.
2Reliability
If sockets are fixed to molded substrates using individual screws, then secure connection is achieved, but assembly time and costs increase
Solution Approach 1:
The patent combines multiple connection functions into a single circuit board assembly. The circuit board integrates socket mounting, common line connections, and electrical wiring into one unified component, allowing all connections to be established simultaneously through standardized circuit board mounting processes rather than individual screw operations.
Solution Approach 2:
The circuit board serves multiple functions simultaneously: it provides electrical connections through conductive traces, mechanical support through its rigid structure, and socket mounting through integrated holder structures. This multi-functionality eliminates the need for separate components and assembly steps for each function.
3Reliability
If wires for supplying lamp drive voltages are connected to inverter unit outside the backlight unit, then electrical connection is achieved, but wire arrangement becomes complex and volume increases
Solution Approach 1:
The patent merges the inverter unit with the circuit board by integrating it directly onto the same substrate. This integration eliminates the need for external wire connections between separate inverter and backlight units, as all electrical connections are established through conductive traces on the circuit board itself.
Solution Approach 2:
The patent replaces the external wire connection system with an integrated circuit board trace system. Instead of using physical wires to connect the inverter unit to the backlight lamps, electrical connections are established through conductive pathways etched onto the circuit board, eliminating wire management complexity and reducing overall volume.
Data Source
AI summary
A backlight unit and a liquid crystal display using the same are provided. The backlight unit includes a plurality of lamps, each including first and second electrodes, first and second substrates, a bottom case for receiving the substrates and lamps, first and second inverter units, and first and second wires. First and second common electrode patterns are formed on the first and second substrates and are commonly connected to the first and second electrodes, respectively. The first and second inverter units are disposed on a rear surface of the bottom case at positions corresponding to the first and second substrates, respectively. The first wire connects the first common electrode pattern and the first inverter unit via holes in the first substrate and the bottom case. The second wire connects the second common electrode pattern and the second inverter unit via holes in the second substrate and the bottom case.