Backlight Assembly Isolation Wall Height for Mini LED Protection
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Solution Overview
Problem
Existing Mini LED display technologies require complex molding processes that can damage the light-emitting elements and are costly to repair, with high technical requirements for maintaining light consistency and uniformity, and result in low production yield.
Innovation Solution
A backlight assembly with isolation walls on the substrate that are taller than the light-emitting elements, spaced apart to prevent damage during assembly and facilitate maintenance, eliminating the need for molding parts and ensuring consistent light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding parts are added on the substrate to protect light-emitting elements, then the light-emitting elements are protected from damage, but the production process becomes complex and costly with low production yield
Solution Approach 1:
The patent merges the isolation wall structure with the substrate by directly forming isolation walls on the substrate surface using photolithography and etching processes. This integration eliminates the need for separate molding parts while maintaining protection of light-emitting elements, thereby reducing production process complexity and improving yield.
Solution Approach 2:
The patent extracts the protective function from separate molding parts and integrates it into the substrate structure itself through isolation walls. This extraction eliminates the need for additional molding components while preserving the protective function, simplifying the overall production process.
2Reliability
If molding parts are added on the substrate to protect light-emitting elements, then the light-emitting elements are protected from damage, but repair costs increase
Solution Approach 1:
By merging the protective function into the substrate-integrated isolation walls rather than using separate molding parts, the patent enables easier repair processes. The isolation walls are formed through standard semiconductor fabrication processes that can be reworked or repaired using conventional techniques, reducing repair costs compared to replacing entire molding assemblies.
3Reliability
If molding parts are added on the substrate to protect light-emitting elements, then the light-emitting elements are protected from damage, but production yield decreases
Solution Approach 1:
The patent merges the protective isolation walls directly into the substrate fabrication process using photolithography and etching, which are standard high-yield semiconductor manufacturing techniques. This integration eliminates the need for separate molding part assembly steps that reduce yield, thereby maintaining protection while improving production yield.
4Reliability
If isolation walls are made taller than light-emitting elements to prevent damage, then protection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by making the isolation wall height specifically greater than the light-emitting element height only in the regions where protection is needed, while other parts of the substrate maintain their original characteristics. This localized approach provides necessary protection without requiring high precision across the entire substrate, reducing overall manufacturing precision requirements.
Data Source
AI summary
A backlight assembly and a display device. The backlight assembly includes: a substrate; a plurality of light-emitting elements for emitting light, wherein the plurality of light-emitting elements are disposed on the substrate; and an isolation wall disposed on the substrate, wherein, the light-emitting elements and the isolation wall are spaced apart from each other on the substrate; a height of the isolation wall is greater than a height of the light-emitting element in a first direction which is a direction of thickness of the substrate. The present disclosure does not require the process of adding molding parts on the substrate by disposing the isolation wall on the substrate. The isolation wall and the light-emitting elements are spaced apart from each other to facilitate subsequent replacement and maintenance. The height of the isolation wall is greater than the height of the light-emitting element.