Backlight Assembly L-Shaped PCB RCC Film Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional edge type backlight assemblies for liquid crystal display devices face challenges in heat radiation efficiency due to the use of heat-radiating pads and LED housings, which increase bezel thickness and reduce heat-radiation efficiency, making it difficult to achieve a slim profile and efficient heat dissipation.
Innovation Solution
The proposed backlight assembly incorporates a Resin Coated Copper (RCC) film attached to the inner lateral surface of a printed circuit board or LED housing, eliminating the need for a heat-radiating pad and optimizing heat radiation by using an L-shaped printed circuit board or a U-shaped LED housing, and in some configurations, directly attaching the RCC film to the bottom cover, thereby enhancing heat dissipation and allowing for a narrow bezel design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-radiating pad and LED housing are used in a conventional edge type backlight assembly, then the light source can be supported and heat can be radiated, but the bezel thickness increases and heat-radiation efficiency deteriorates
Solution Approach 1:
The patent merges the support function and heat radiation function into a single integrated structure. The printed circuit board is extended to directly support the light source, and the RCC film is integrated into the printed circuit board structure, eliminating the need for separate heat-radiating pads and LED housings. This consolidation reduces the number of components and simplifies the heat radiation path, thereby improving heat-radiation efficiency while reducing bezel thickness.
Solution Approach 2:
The patent extracts and eliminates unnecessary components from the conventional backlight assembly structure. By removing the separate heat-radiating pad and LED housing, the design achieves a more compact configuration. The essential heat radiation function is retained through the RCC film integrated into the printed circuit board, while the redundant structural elements are removed, leading to reduced bezel thickness and improved heat radiation efficiency.
2Reliability
If a heat-radiating pad and LED housing are used in a conventional edge type backlight assembly, then the light source can be supported and heat can be radiated, but the structure becomes more complex with more components
Solution Approach 1:
The patent combines multiple functions into fewer components. The printed circuit board serves both as an electrical connection medium and as a structural support element for the light source. The RCC film is integrated into the printed circuit board, combining electrical conductivity and heat radiation functions in a single layered structure. This merging reduces the total number of components while maintaining reliable heat radiation functionality.
Solution Approach 2:
The printed circuit board is designed to perform multiple functions simultaneously: electrical connection, structural support, and heat radiation. The RCC film layer provides both electrical conductivity for signal transmission and thermal conductivity for heat dissipation. This multi-functionality reduces the need for separate dedicated components, thereby simplifying the overall device structure while ensuring reliable heat radiation.
3Temperature
If conventional components are used for heat radiation, then heat can be dissipated, but manufacturing costs increase due to additional parts
Solution Approach 1:
The patent merges the heat radiation function into the existing printed circuit board structure through the integration of the RCC film. This eliminates the need for separate heat-radiating pads and LED housings, reducing the number of parts that need to be manufactured, procured, and assembled. The integrated design leverages the existing printed circuit board manufacturing process, potentially reducing overall manufacturing costs while maintaining effective heat dissipation.
Solution Approach 2:
The patent removes unnecessary components from the bill of materials, directly reducing manufacturing costs. By eliminating the separate heat-radiating pad and LED housing, the design reduces material costs, assembly costs, and inventory requirements. The essential heat radiation capability is maintained through the integrated RCC film in the printed circuit board, achieving cost reduction without sacrificing thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat radiation efficiency, reduces manufacturing costs, and enables a slim profile by eliminating unnecessary components, while ensuring reliable fastening and enhanced assembly efficiency.
Implementation Method 1
a Resin Coated Copper (RCC) film attached to an inner lateral surface of the single metal layer
Data Source
AI summary
A backlight assembly is disclosed that is capable of enabling easy narrow bezel design and easily radiating heat generated from a light source, and a liquid crystal display device using the same. The backlight assembly includes a bottom cover, a light guide plate placed on the bottom cover, a printed circuit board having an L-shaped form and attached to a bottom surface and inner lateral surface of the bottom cover, and a plurality of Light Emitting Diode (LED) packages being mounted to the printed circuit board, wherein the printed circuit board includes a single metal layer having the L-shaped form and attached to the bottom surface and the inner lateral surface of the bottom cover; and a Resin Coated Copper (RCC) film attached to an inner lateral surface of the single metal layer.