Backlight Module Lateral Circuit Board Nesting

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Solution Overview

Problem

Conventional liquid crystal display devices have a wide rim due to the thickness of the printed circuit board in the backlight module, which requires the back plate to extend beyond the edge of the module, making the design bulky and inefficient.

Innovation Solution

A backlight module design featuring a light guide plate with a circuit board and LED lamp positioned on its lateral surface, where the circuit board is parallel to the light guide plate and shares thickness space with the reflective film, allowing the back plate to remain flat and within the module's edge, utilizing double-sided thermal adhesive for fixation and thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the printed circuit board is placed in the backlight module to provide electrical connection, then the backlight module can function properly, but the back plate has to extend beyond the edge of the backlight module to provide space for the light source, making the rim wider

Engineering Contradiction:
Improvebacklight module functionalityVSAvoidrim width
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The circuit board is rotated from a horizontal placement to a vertical placement, standing upright against the light guide plate. This dimensional change allows the circuit board to be positioned within the thickness of the backlight module rather than extending beyond its edges, thereby reducing the rim width while maintaining electrical connection functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The circuit board is nested within the thickness dimension of the backlight module by positioning it vertically against the light guide plate. This nesting approach allows the circuit board to occupy the internal space of the module rather than requiring external extension, effectively reducing the overall rim width.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If the circuit board is positioned to provide electrical connection for the LED lamp, then the backlight module can operate, but the module thickness increases due to the printed circuit board width

Engineering Contradiction:
Improveelectrical connectionVSAvoidmodule thickness
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The circuit board is reoriented from a horizontal plane to a vertical plane, changing the dimension in which it occupies space. This allows the circuit board to be positioned within the existing thickness envelope of the backlight module, preventing increase in module thickness while maintaining electrical connection capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the back plate is extended beyond the module edge to accommodate the light source, then the light source can be properly positioned, but the exterior aesthetics are degraded and the design becomes bulky

Engineering Contradiction:
Improvelight source positioningVSAvoidexterior aesthetics
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

By rotating the circuit board to a vertical orientation, the light source can be positioned within the module's original aesthetic envelope rather than requiring the back plate to extend beyond the edges. This maintains a flat, clean exterior appearance while still allowing proper light source positioning for optimal performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design thins the backlight module by allowing the back plate to remain flat at the incident side, enhancing the exterior aesthetics and reducing the module's thickness while ensuring effective thermal management and light emission.

Implementation Method 1

there is a double-sided thermal adhesive between the circuit board and the back plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a light emitting diode (LED) lamp electrically connected to the circuit board

Methodology Applied
Scientific EffectLight emitting diode: Light Emitting Diode

Implementation Method 3

there is a thermal insulation pad sandwiched between the LCD screen and a surface of the circuit board away from the light guide plate

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10495925B2Backlight module and display device
Publication Date: 2019.12.03 HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US10495925B2 patent drawing
  • US10495925B2 patent drawing

AI summary

The disclosure provides a backlight module includes a light guide plate and a light source device configured to provide light to the light guide plate. The light source device includes a circuit board and a LED lamp electrically connected to the circuit board. The LED lamp is external to the light guide plate and at a lateral surface of the light guide plate. The circuit board is parallel to the light guide plate with a portion pressed on another lateral surface of the light guide plate. The disclosure provides a display device includes a frame and a liquid crystal display screen and the backlight module installed on the frame. The reflective film and the circuit board share a part of room for thickness, so the thickness of the backlight module is reduced and the module is thinned.