Backlight Unit Metal Board Bending for Heat Dissipation
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Solution Overview
Problem
The existing backlight units for liquid crystal display devices face challenges with heat dissipation and increased costs due to the use of multiple LED packages, which affect the efficiency and performance of the display.
Innovation Solution
A backlight unit design featuring a cover bottom with metal boards having a bent part and insulated wires, where LED packages are mounted on the bent part, and a light guide plate is installed, enhancing heat dissipation and allowing for adjustable light diffusion angles, reducing the number of LED packages needed by approximately 1/10 while increasing luminous flux per package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED packages are used to increase luminous flux, then light output is improved, but heat dissipation becomes difficult and cost increases
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional spatial utilization by bending the metal board at a specific angle. This allows the LED package to be positioned in a tilted configuration, improving heat dissipation by directing heat away from the cover bottom while maintaining high luminous flux output.
Solution Approach 2:
The metal board is divided into distinct functional segments: a body part for mounting and electrical connection, and a bent part for heat dissipation and angular positioning. This segmentation allows each part to optimize its specific function - electrical connectivity on the body part and thermal management on the bent part.
2Illumination intensity
If multiple LED packages are used to increase luminous flux, then light output is improved, but device complexity and cost increase
Solution Approach 1:
The patent changes the mounting angle parameter of the LED package by bending the metal board. This angular parameter change allows a single LED package to achieve the luminous flux that would otherwise require multiple packages, thereby reducing device complexity and cost while maintaining light output performance.
3Illumination intensity
If LED packages are mounted on the cover bottom, then light source positioning is achieved, but heat dissipation properties deteriorate
Solution Approach 1:
The metal board is bent into a curved or angled configuration rather than remaining flat. This curvature allows the LED package to be positioned at an optimal angle for both light emission toward the liquid crystal panel and heat dissipation away from the cover bottom, resolving the conflict between positioning and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation properties and reduces the number of LED packages required, enhancing the efficiency of light transmission and reducing costs, while maintaining or improving light distribution and display performance.
Implementation Method 1
at least one pairs of metal boards, each being installed on the cover bottom... improves heat dissipation properties
Data Source
AI summary
There is provided a backlight unit including a cover bottom, at least one pairs of metal boards, each being installed on the cover bottom, having a body part and a bent part bent in one end region of the body part, and including an insulated wire on a surface thereof, at least one LED package mounted on the bent part; and a light guide plate installed at the cover bottom.