Backlight Module Aluminum Extrusion Heat Dissipation
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Solution Overview
Problem
Conventional LED backlight modules for LCDs face inefficiencies in heat dissipation due to a small contact area between aluminum extrusions and air, leading to reduced heat dissipation efficiency and increased costs with aluminum backplanes.
Innovation Solution
An integrated backlight module design where an LED light source is fixed on an aluminum extrusion, which is embeddedly joined with a backplane, increasing the contact area with air and enhancing heat dissipation through an L-shaped cross section, embedded length, and anti-disengaging structures like protrusions or through holes, and optionally using heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum extrusion is arranged inside the backplane for heat dissipation, then the structure is compact, but the contact area between aluminum extrusion and air is small resulting in poor heat dissipation efficiency
Solution Approach 1:
The aluminum extrusion is repositioned from an internal arrangement to an external arrangement protruding from the backplane surface. This dimensional change allows the aluminum extrusion to access external air flow, dramatically increasing the contact area between the heat dissipation component and the cooling medium, thereby resolving the heat dissipation efficiency problem.
2Temperature
If the whole backplane is made of aluminum or aluminum alloy for heat dissipation, then heat dissipation capacity is improved, but the cost increases significantly
Solution Approach 1:
Instead of making the entire backplane from expensive aluminum alloy, the invention applies aluminum alloy only to the specific heat dissipation component (the extrusion) that requires it. The backplane itself can remain as a lower-cost material, thus achieving the necessary heat dissipation capacity at a reduced overall cost.
Solution Approach 2:
The invention combines the backplane structure with the aluminum extrusion heat dissipation component into an integrated assembly. The aluminum extrusion is embedded in or attached to the backplane, creating a hybrid structure that leverages the thermal conductivity of aluminum where needed while maintaining cost-effectiveness overall.
3Temperature
If aluminum extrusion protrudes externally from the backplane, then heat dissipation efficiency is improved, but the appearance may be affected and structural integrity may be compromised
Solution Approach 1:
The aluminum extrusion is embedded within or nested into the backplane structure rather than being merely attached to its surface. This nesting arrangement allows the extrusion to protrude externally for heat dissipation while being structurally integrated with the backplane, maintaining overall structural integrity and stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation efficiency while maintaining structural integrity and appearance, reducing the risk of strength issues and aligning the outer surfaces for enhanced joining strength.
Implementation Method 1
the contact area between the aluminum extrusion and air is small, thus, the heat dissipation efficiency cannot be increased
Implementation Method 2
an aluminum extrusion 2, and the aluminum extrusion 2 is mainly used for heat dissipation
Data Source
AI summary
The invention discloses a backlight module and an LCD device including the backlight module. The backlight module includes a light source, an aluminum extrusion, and a backplane. The light source is fixed on the aluminum extrusion, and the aluminum extrusion and the backplane are integratedly joined. The aluminum extrusion heat dissipation is used by the backlight module of the LCD device of the invention, the aluminum extrusion and the backplane are integratedly joined, the contact area between the aluminum extrusion and air is increased, and thus high-efficiency heat dissipation is obtained.


