Backlight Module Bended Metal Plate Heat Dissipation
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Solution Overview
Problem
The existing backlight module structures for large-size liquid crystal displays suffer from low heat dissipation efficiency, leading to heat accumulation and reduced lifespan of the light source due to increased power requirements for higher luminance.
Innovation Solution
The proposed backlight module design includes a metal rear plate with a bended structure and protruding features that enhance heat dissipation by creating channels for heat transfer, eliminating the need for heat dissipation glue and simplifying assembly, while using a side light source configuration to improve light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If higher power light sources or more light sources are used to meet higher luminance requirements, then illumination intensity is improved, but heat generation increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces a three-dimensional heat dissipation structure with the metal rear plate featuring a bended portion that extends toward the light guide plate, creating vertical and lateral heat dissipation pathways. This multi-dimensional structural arrangement enables heat to dissipate through multiple directions simultaneously, effectively managing thermal load from high-power light sources without compromising luminance output.
Solution Approach 2:
The patent employs thermal paste as a thermal interface material between the circuit substrate and metal rear plate, and uses the metal rear plate itself as a heat sink intermediary. This intermediary structure conducts heat away from the light sources through its extended bended portion, facilitating efficient heat transfer from the high-power light sources to the surrounding environment.
2Strength
If heat dissipation glue is used to fix the circuit substrate on the metal rear plate, then fixing strength is improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent segments the fixing function by introducing separate fixing portions on the metal rear plate that mechanically engage with the circuit substrate. This segmentation eliminates the need for thermal paste application, allowing for simpler assembly processes while maintaining adequate fixing strength through the mechanical interlocking structure.
Solution Approach 2:
The patent extracts the heat dissipation function from the heat dissipation glue, separating it into a dedicated metal rear plate structure with bended portions. This extraction allows the fixing mechanism to be simplified while heat dissipation is handled by the specialized metal structure, reducing manufacturing complexity and improving assembly efficiency.
3Volume of moving object
If the light source is disposed on the circuit substrate within a confined chamber, then structural compactness is improved, but heat accumulation occurs and reliability decreases
Solution Approach 1:
The patent uses the bended portion of the metal rear plate extending in a direction toward the light guide plate to create additional heat dissipation pathways in the vertical dimension. This three-dimensional heat dissipation architecture allows effective thermal management within the compact chamber structure, preventing heat accumulation while maintaining structural compactness.
Solution Approach 2:
The metal rear plate serves multiple functions simultaneously: it provides structural support for the circuit substrate, acts as a heat sink through its bended portion, and facilitates heat dissipation toward the light guide plate. This multi-functionality enables effective heat management in the compact structure without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances heat dissipation efficiency, reduces damage to the light source, and extends the lifespan of the backlight module, while also lowering production costs and improving assembly efficiency.
Implementation Method 1
a light guide plate, located above the bottom plate, and side edges of the light guide plate being surrounded by the bottom plate, the side edge structure, and the bended structure of the metal rear plate
Implementation Method 2
When the light source 26 is turned on, a large amount of heat will be generated. The generated heat is transferred to the metal rear plate 21 via the circuit substrate 27 and the heat dissipation glue 18, and then transferred to the outside of the backlight module by the metal rear plate 21
Data Source
AI summary
An embodiment of the invention provides a backlight module, comprising: a metal rear plate, comprising a bottom plate, a side edge structure and a bended structure; a light strip structure including a circuit substrate and a light source disposed on the circuit substrate; and an outer frame, wherein, the bended structure is provided with a first protruding structure extending toward the light strip structure, the bottom plate is provided with a second protruding structure extending toward the light strip structure, the circuit substrate of the light strip structure is fixed on the side edge structure by the first and second protruding structures, the side edge structure is provided with a first opening aligned with to the light source, the outer frame is provided with a second opening corresponding to the first opening.