Backlight Module Circuit Integration and Light Reflection
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Solution Overview
Problem
Conventional backlight modules for electronic devices have a complex structure and volume due to the presence of multiple layers, which complicates assembly and reduces light utilization efficiency, especially with silver paste circuits that absorb light and cause chromatic issues.
Innovation Solution
A simplified backlight module design where the lower thin film layer is removed, and circuits are directly installed on the light guide unit, with a reflection layer between the silver paste circuit and the light guide unit to enhance light reflection and reduce absorption, and the light source is positioned to project light into the light guide unit's lateral side, optimizing light output and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional multi-layer structure with lower thin film layer is used, then the circuit can be installed separately, but the assembly process becomes complex and volume increases
Solution Approach 1:
The patent combines the lower thin film layer with the light guide unit into a single integrated component. The circuit that was previously installed on the separate lower thin film layer is now directly mounted on the light guide unit itself, eliminating the need for the separate lower thin film layer and reducing assembly steps
Solution Approach 2:
The light guide unit is given multiple functions: it serves both as the light guiding component and as the mounting substrate for the circuit. This multi-functional design eliminates the need for the separate lower thin film layer that previously served only as a circuit mounting surface
2Ease of manufacture
If silver paste circuit is directly installed on light guide unit, then assembly is simplified, but light absorption increases and chromatic issues occur
Solution Approach 1:
The patent introduces a reflection layer as an intermediary between the silver paste circuit and the light guide unit. This reflection layer prevents direct contact between the light-absorbing silver paste and the light path, while still allowing the circuit to be mounted on the light guide unit. The reflection layer reflects light that would otherwise be absorbed by the circuit back into the light guide unit
Solution Approach 2:
The patent converts the harmful light-absorbing property of the silver paste circuit into a beneficial reflection mechanism. By placing a reflection layer behind the circuit, the circuit's presence is compensated for by the reflected light, turning the potential harm (light absorption) into a benefit (enhanced light output through reflection)
3Volume of stationary object
If light source is installed at lateral side, then volume is reduced, but light output efficiency may be affected
Solution Approach 1:
The patent transitions from a conventional top-mounted light source configuration to a lateral-side mounted light source configuration. This dimensional change in light source positioning reduces the overall device volume while the reflection layer ensures that light is efficiently directed through the light guide unit, maintaining output efficiency despite the compact arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces the device's volume, increases light reflection and utilization, and improves the quality of output light by minimizing absorption and chromatic effects, resulting in enhanced brightness and efficiency.
Implementation Method 1
a reflection layer formed with a first pattern and installed on the light output surface of the light guide unit
Data Source
AI summary
The present invention relates to a backlight module and a manufacturing method thereof. The backlight module comprises a thin film unit, a light guide unit, an insulation layer and at least a light source. The thin film unit is installed with a first circuit. The light guide unit is installed with a second circuit. The insulation layer is installed between the thin film unit and the light guide unit. The light source is electrically connected to the first circuit, and the light thereof projects into the light guide unit.