Thermally Conductive Backlight Module Heat Dissipation
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Solution Overview
Problem
The existing backlight modules face heat dissipation issues due to enclosed LED lamps, leading to device malfunction and failure.
Innovation Solution
Incorporating a thermally conductive backboard made of materials like stainless steel or aluminum alloy, combined with a thermally conductive layer and grooves, to facilitate direct contact and efficient heat transfer from the LED lamps to the outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If LED lamps are enclosed in the backlight module, then the structural integrity is improved, but heat dissipation deteriorates leading to device malfunction
Solution Approach 1:
A thermally conductive layer is introduced as an intermediary component between the LED lamps and the external environment. This layer facilitates heat transfer from the enclosed LED lamps to the heat dissipation structure, resolving the contradiction by enabling thermal exchange without compromising the enclosed structural integrity.
Solution Approach 2:
The backboard is changed from a conventional material to a thermally conductive material (such as aluminum alloy or stainless steel with specific thermal conductivity). This parameter change enables the backboard to serve dual functions: maintaining structural integrity while simultaneously providing effective heat dissipation pathways.
2Illumination intensity
If the LED lamps are enclosed in an enclosed space, then the optical performance is improved, but heat dissipation deteriorates
Solution Approach 1:
The enclosed space is segmented into functional zones: an optical enclosure for maintaining illumination performance and a thermal pathway for heat dissipation. The thermally conductive layer and groove structure create separate channels for optical function and thermal management, allowing both requirements to be satisfied simultaneously.
Solution Approach 2:
The heat generated by LED lamps, which is normally a harmful factor causing device failure, is converted into a beneficial element by channeling it through the thermally conductive layer to pre-heat the heat dissipation structure or to be efficiently transferred to the backboard for external dissipation, thereby improving overall thermal management efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from the LED lamps, preventing device malfunction and extending the lifespan of the backlight module.
Implementation Method 1
Incorporating a thermally conductive backboard made of materials like stainless steel or aluminum alloy, combined with a thermally conductive layer and grooves, to facilitate direct contact and efficient heat transfer from the LED lamps to the outside
Data Source
AI summary
A backlight module having better heat dissipation, includes a backboard, a frame coupled to a peripheral area of the backboard, at least one light source, and a thermally conductive layer located on the backboard. The backboard is made of a thermally conductive material. The at least one light source is embedded in the thermally conductive layer and in direct contact with the thermally conductive layer which removes heat as it is generated by the light source.