Backlight Module Gap Design for LCD Thermal Management

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Solution Overview

Problem

Conventional backlight modules for LCDs suffer from inefficient heat dissipation, leading to elevated panel temperatures and the risk of liquid crystal liquefaction due to direct heat conduction from LED lightbars, which affects the optical display quality and longevity.

Innovation Solution

A backlight module design featuring a side frame with a groove to create a gap between the rear panel's side wall and the side frame, combined with a heat-shield material and thermal insulating spacers, prevents heat transfer from the light source to the LCD panel, maintaining the thin profile of LCD devices while enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the frame is directly arranged on the side wall in contact mode to achieve narrow frame design, then the device thickness is reduced, but heat is conducted from the LED lightbar through the side wall to the LCD panel causing overheating

Engineering Contradiction:
Improvedevice thicknessVSAvoidpanel temperature
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The side wall structure is segmented into multiple parts: the first side wall portion contacts the frame, while the second side wall portion extends toward the LCD panel but maintains a gap. This segmentation allows the frame to be positioned away from the heat-generating LED lightbar while still providing structural support, thereby reducing heat conduction to the panel without significantly increasing device thickness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The spacer serves as an intermediary component between the frame and the second side wall portion. It maintains a predetermined gap distance, preventing direct thermal contact between the frame (which is in contact with the LED lightbar) and the second side wall portion that is closer to the LCD panel, thus blocking the heat conduction path.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If air vents are used for heat dissipation through convection, then heat can be conducted outside, but the heat dissipation efficiency remains low

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidheat dissipation effect
Core Design Contradiction:
Loss of energyVSProductivity

Solution Approach 1:

The harmful heat energy is extracted from the system by creating a gap between the frame and the second side wall portion, which interrupts the thermal conduction path. This extraction of heat through structural design, rather than relying solely on convection through air vents, significantly improves heat dissipation efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If the rear panel is moved backward to create a gap between the side wall and frame, then heat transfer is reduced, but the device thickness increases

Engineering Contradiction:
Improveheat transfer preventionVSAvoiddevice thickness
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The side wall is divided into two portions: the first side wall portion that contacts the frame and the second side wall portion that maintains a gap. This segmentation allows heat transfer prevention without requiring the entire rear panel to be moved backward, thus avoiding significant increases in device thickness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of creating distance in the thickness dimension (which would increase device volume), the solution creates a gap in the lateral dimension by extending the second side wall portion toward the LCD panel while maintaining separation from the frame. This dimensional approach prevents heat transfer without compromising the thin profile.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively blocks heat transfer from the light source to the LCD panel, reducing the risk of liquid crystal liquefaction and improving optical display quality by utilizing a gap and heat-shield materials to manage heat dissipation without increasing device thickness.

Implementation Method 1

the heat of the LED lightbar is upward conducted to the frame through the side wall of the rear panel, and then is conducted to the panel through a spacer

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

combined with a heat-shield material and thermal insulating spacers, prevents heat transfer from the light source to the LCD panel

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS8842234B2Backlight module and LCD device having a gap between a top of a side wall of a rear panel and a groove on top of the side wall
Publication Date: 2014.09.23 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US8842234B2 patent drawing
  • US8842234B2 patent drawing
  • US8842234B2 patent drawing

AI summary

The invention provides a backlight module and a LCD device. The backlight module includes a side frame, and a rear panel; the rear panel is provided with a side wall fixedly matched with the side frame, the side wall of the rear panel is provided with a light source, and a gap is reserved between the top of the side wall and the side frame. The invention can effectively block the path that the heat at the side of the light source is transferred to the LCD panel, and can effectively prevent the risk of the liquid crystal liquefaction of the LCD panel, thereby improving the optical display taste of the LCD panel.