Backlight Module Heat Dissipation Layer Overlap
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Solution Overview
Problem
Display devices, such as LCDs, face poor heat dissipation due to localized heat buildup from light source components, leading to reduced performance.
Innovation Solution
A backlight module with a first heat dissipation layer in the overlapping zone between the backplane and light source components, enhancing heat conduction and distribution, potentially combined with a second heat dissipation layer and a leveling layer for improved heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is relied on the backplane alone, then the structure is simple, but the heat dissipation effect is poor due to localized heat buildup
Solution Approach 1:
The heat dissipation function is segmented into multiple components: the backplane provides overall support and heat dissipation, while the first heat dissipation layer (arranged in the overlapping zone between backplane and light source component) and second heat dissipation layer (arranged above or below the light source component) provide localized heat dissipation. This segmentation allows each component to specialize in specific heat dissipation tasks, improving overall heat dissipation effectiveness without requiring complete structural redesign.
Solution Approach 2:
The patent introduces heat dissipation layers in multiple spatial dimensions: the first heat dissipation layer is arranged in the overlapping zone (between backplane and light source component), while the second heat dissipation layer is arranged above or below the light source component. This multi-dimensional arrangement creates additional heat dissipation pathways in different spatial directions, effectively addressing localized heat buildup without significantly increasing structural complexity.
2Temperature
If the light source component directly contacts the backplane, then the assembly is simple, but localized heat buildup occurs at the contact area
Solution Approach 1:
The first heat dissipation layer arranged in the overlapping zone acts as an intermediary between the light source component and the backplane. This intermediate layer facilitates heat transfer from the light source component to the backplane while distributing the heat over a larger area, preventing localized heat buildup at the direct contact interface. The intermediary layer effectively mediates the thermal interaction between the two components.
Solution Approach 2:
The patent applies local quality by placing the first heat dissipation layer specifically in the overlapping zone where the light source component contacts the backplane. This localized heat dissipation structure addresses the specific heat problem at the contact area without requiring modification of the entire assembly structure. The local quality approach allows targeted heat management where it is most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Uniform and quick heat dissipation across the display device, preventing localized heat buildup and ensuring optimal performance.
Implementation Method 1
the first heat dissipation layer with good heat conduction property is arranged in the overlapping zone for the backplane and the light source component, hence the high heat generated by the LEDs can be conducted to a local area of the first heat dissipation layer corresponding to the LEDs
Implementation Method 2
the heat can be distributed uniformly across the first heat dissipation layer. Compared with the backlight module mentioned in the background of the invention, the heat dissipation area for the heat conducted to the local area is increased, the heat will be uniformly distributed across the first heat dissipation layer and dissipated
Data Source
AI summary
A backlight module and a display device are disclosed, which relate to the field of display technology and overcome the problem of poor heat dissipation effect of the whole display device. The backlight module comprises a backplane, a light source component fixed to the backplane, and a first heat dissipation layer at least arranged in part of the overlapping zone for the backplane and the light source component. The display device comprises a display panel and the backlight module mentioned above, and the backlight module provided by the embodiment is applied in the display device.