Backlight Module Heat Dissipation Structure for QD-Mini LED
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Solution Overview
Problem
Existing Quantum Dot Mini Light Emitting Diodes (QD-mini LED) technologies face challenges with heat dissipation, leading to reduced luminous efficiency due to overheating.
Innovation Solution
A backlight module design incorporating a substrate with light emitting diodes, a quantum dot layer, a light-shielding layer, and a heat dissipation structure, where the heat dissipation structure is positioned on the opposite surface to absorb and dissipate heat, and the light-shielding layer is used to block stray lights and alleviate optical crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If QD-mini LED is used to achieve high resolution and color performance, then display quality is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate and introduces a dedicated heat dissipation structure (metal layer or heat dissipation chamber) to separately handle thermal management, allowing the display components to focus on optical performance while heat is actively managed by the specialized structure
Solution Approach 2:
The patent introduces a heat dissipation structure as an intermediary between the light emitting diodes and the external environment, using metal layers or heat dissipation chambers to mediate heat transfer and dissipation, thereby protecting the display components from excessive heat while maintaining display quality
2Manufacturing precision
If light emitting diodes are densely arranged to improve resolution, then display resolution is improved, but optical crosstalk increases
Solution Approach 1:
The patent extracts the light shielding function from the overall structure and introduces a dedicated light shielding layer to separately handle optical isolation, allowing closely spaced light emitting diodes to maintain high resolution while the light shielding layer prevents optical crosstalk between adjacent elements
3Temperature
If heat dissipation structure is added to improve thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent designs the heat dissipation structure to serve multiple functions: the metal layer or heat dissipation chamber not only dissipates heat but also provides structural support and protection, thereby improving heat dissipation performance while minimizing the increase in device complexity through multi-functional integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation, reducing overheating and improving luminous efficiency while minimizing optical crosstalk, resulting in a more efficient and stable display performance.
Implementation Method 1
The quantum dot layer is disposed on one side of the multiple light emitting diodes facing away from the substrate. The multiple light emitting diodes are each configured to emit lights of a first color. The lights of the first color are of the first color, a second color, or a third color after passing through the quantum dot layer.
Implementation Method 2
The heat dissipation structure is disposed on the second surface... effectively enhances heat dissipation, reducing overheating and improving luminous efficiency
Implementation Method 3
The light-shielding layer is disposed between each two adjacent light emitting diodes... block stray lights and alleviate optical crosstalk
Data Source
AI summary
A backlight module and a liquid crystal display panel are provided. The backlight module includes a substrate, multiple light emitting diodes, a quantum dot layer, a light-shielding layer, and a heat dissipation structure. The substrate has a first surface and a second surface opposite to the first surface. The multiple light emitting diodes are disposed on the first surface. The quantum dot layer is disposed on one side of the multiple light emitting diodes facing away from the substrate. The multiple light emitting diodes are each configured to emit lights of a first color. The lights of the first color are of the first color, a second color, or a third color after passing through the quantum dot layer. The light-shielding layer is disposed between each two adjacent light emitting diodes. The heat dissipation structure is disposed on the second surface.


