Backlight Module Layout for Slim Display Heat Dissipation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing display apparatuses face challenges in efficiently dissipating heat generated by slim light sources, leading to reduced reliability due to high temperature transfer affecting components like the light conversion member and diffusion sheet, which degrades performance.

Innovation Solution

The display apparatus incorporates a light source module with a direct contact between the LED chip and a rear chassis, utilizing a housing with high thermal conductivity to efficiently dissipate heat, and omits diffusion and reflective sheets to maintain slimness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the separation distance between components in the backlight unit is reduced to achieve slimness, then the thickness of the display apparatus is decreased, but heat generated from the light source is transferred to other components, deteriorating reliability

Engineering Contradiction:
Improvethickness of display apparatusVSAvoidreliability of backlight unit
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The patent removes the diffusion sheet and reflective sheet from the backlight unit structure. By extracting these components, the light path is optimized to allow light to reach the display panel more directly, eliminating the need for these intermediate layers. This reduction in component layers achieves slimness while the redesigned light path and direct LED-to-chassis mounting improve heat dissipation, preventing thermal damage to remaining components.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the LED chip mounting directly onto the rear chassis, eliminating separate mounting structures and intermediate components. This integration allows the rear chassis to serve dual purposes: structural support and heat dissipation pathway. The direct thermal contact between LED chip and chassis creates an efficient heat transfer route, resolving the contradiction between compact design and thermal management.

Inventive Principle:
Principle #5Merging (Combining)

2Illumination intensity

If diffusion sheets and reflective sheets are included in the backlight unit, then light distribution is improved, but the overall thickness increases and heat dissipation efficiency decreases

Engineering Contradiction:
Improvelight distribution uniformityVSAvoidthickness of backlight unit
Core Design Contradiction:
Illumination intensityVSLength of moving object

Solution Approach 1:

The patent extracts and removes the diffusion sheet and reflective sheet from the optical path. By eliminating these layers, the backlight unit thickness is significantly reduced. The patent compensates for the lost light distribution function through optimized LED arrangement and direct light transmission paths, achieving acceptable uniformity without the thermal and thickness penalties of traditional diffusion/reflective sheet designs.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If traditional backlight components are used with adequate separation, then reliability is maintained, but the display apparatus cannot achieve slimness

Engineering Contradiction:
Improvecomponent performance stabilityVSAvoidseparation distance between components
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent merges the LED chip mounting structure directly with the rear chassis, creating an integrated assembly. This consolidation eliminates intermediate mounting components and reduces the separation distance between light-generating and light-dissipating elements. The rear chassis serves as both structural support and heat sink, maintaining component reliability through direct thermal coupling while achieving the slim profile required by modern display designs.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation, maintains slimness, and improves reliability by preventing thermal discoloration and expansion of components, ensuring efficient light transmission and performance.

Implementation Method 1

a light source module 100 including a light source 110 mounted on a mounting surface 121 of a substrate 120 facing in a direction opposite to a first direction A, the light source 110 emitting light in the first direction A

Methodology Applied
Scientific EffectLight emitting diode (LED): Light Emitting Diode

Implementation Method 2

utilizing a housing with high thermal conductivity to efficiently dissipate heat

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3859443B1Display apparatus
Publication Date: 2025.12.24 SAMSUNG ELECTRONICS CO LTD
  • EP3859443B1 patent drawingFigure 1
  • EP3859443B1 patent drawingFigure 2
  • EP3859443B1 patent drawingFigure 3

AI summary

A display apparatus includes a display panel (20) configured to display an image; a light source module (100) provided behind a rear surface of the display panel (20) and configured to emit light to the display panel (20), the light source module (100) including a glass substrate (120) and a light source (110) provided behind a rear surface of the glass substrate (120); and a rear chassis (60) covering the display panel (20) and the light source module (100), wherein the light source (110) is provided between the glass substrate (120) and the rear chassis (60).