Backlight Module Heat Radiation Layer for Mini LED Thermal Management

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Solution Overview

Problem

Mini LED displays face significant heat dissipation challenges due to the large number of LEDs and high heat generation, leading to reduced LED lifespan, as traditional metal back plates are inefficient in managing heat dissipation.

Innovation Solution

A backlight module design featuring a cavity between the light plate and back plate, with a heat radiation material layer made of graphitic carbon attached to the light plate and a gap between the material layer and back plate, along with a thermally conductive silicone heat absorption layer forming a sawtooth structure, enhances active heat absorption and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal back plate is used to dissipate heat from the light plate, then heat dissipation is provided, but the heat dissipation efficiency is relatively low and cannot meet the requirements of Mini LED displays

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidLED lifespan
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

A heat radiation material layer is introduced as an intermediary between the light plate and the back plate. This layer actively absorbs heat from the light plate and radiates it toward the gap between the heat radiation material layer and the back plate, enhancing heat dissipation efficiency beyond what a simple metal back plate could achieve

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the material parameter by using graphitic carbon for the heat radiation material layer, which has superior thermal radiation properties compared to traditional metal back plates. This material substitution enables more efficient heat absorption and radiation, directly addressing the insufficient heat dissipation efficiency of conventional solutions

Inventive Principle:
Principle #35Parameter changes

2Illumination intensity

If Mini LED lamp beads are used in large numbers, then display quality is improved, but heat generation increases significantly

Engineering Contradiction:
Improvedisplay qualityVSAvoidheat generation
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by numerous Mini LED lamp beads into a manageable thermal radiation problem. By using the heat radiation material layer with specific thermal properties, the excessive heat is actively absorbed and radiated away, transforming the harmful thermal effect into a controlled heat dissipation process that supports high-density LED arrangements

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves heat dissipation efficiency, extending the lifespan of Mini LED displays by actively absorbing and radiating heat away from the light plate, outperforming traditional metal back plate solutions.

Implementation Method 1

the heat radiation material layer is arranged in the cavity and is attached to the side of the light plate facing the back plate... After the heat radiation material layer absorbs the heat on the light plate, it radiates heat toward the gap between the heat radiation material layer and the back plate

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

The heat absorption layer is composed of thermally conductive silicone

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11803005B1Backlight module and display device
Publication Date: 2023.10.31 HKC CORP LTD
  • US11803005B1 patent drawing
  • US11803005B1 patent drawing
  • US11803005B1 patent drawing

AI summary

A backlight module and a display device are disclosed. The backlight module includes a back plate and a light plate arranged on the back plate. A cavity is defined between the back plate and the light plate. The backlight module further includes a heat radiation material layer that is arranged in the cavity and attached to the side of the light plate facing the back plate. A gap is defined between the heat radiation material layer and the back plate.