Backlight Module Heat Sink Design for Display Thermal Management
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Solution Overview
Problem
Current backlight module designs fail to effectively dissipate heat from heat concentrated areas of display panels, leading to elevated temperatures that prevent the display panel from functioning as a touch screen.
Innovation Solution
A backlight module design incorporating a light guide plate, a heat sink with a U-shaped bending structure, and a heat conducting device that includes a thermal conductive pad and adhesive tape to efficiently transfer heat from the display panel to the heat sink for dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the display panel operates at high resolution, then the display quality is improved, but the power consumption increases causing heat generation in concentrated areas
Solution Approach 1:
The patent converts the harmful heat generated by high-resolution display operation into a manageable thermal flow by designing a backlight module that actively conducts heat away from the display panel's concentrated heat areas. The heat sink and heat conducting device transform the harmful thermal energy into a controlled heat dissipation pathway, lowering the display panel temperature while maintaining high resolution operation.
Solution Approach 2:
The patent introduces a heat conducting device as an intermediary between the display panel and the heat sink. This intermediary component (heat conducting device) facilitates thermal energy transfer from the heat concentrated areas of the display panel to the heat sink, enabling effective heat dissipation without direct contact between the display panel and the heat sink structure.
2Reliability
If the temperature in heat concentrated area exceeds 42°C, then the display panel cannot function as a touch screen, but adding heat dissipation structures increases device complexity
Solution Approach 1:
The patent makes the backlight module multi-functional by integrating both its original light guiding function and a new heat dissipation function. The backlight module structure (including the heat sink and heat conducting device) serves dual purposes: maintaining backlight performance while actively dissipating heat from the display panel, thereby preventing touch screen malfunction without requiring separate dedicated cooling components.
Solution Approach 2:
The patent merges the heat dissipation function with the existing backlight module structure. The heat sink is integrated into the backlight module design, and the heat conducting device is positioned between the display panel and the heat sink within the backlight module assembly. This combination eliminates the need for separate cooling systems while ensuring touch screen functionality is maintained.
3Device complexity
If conventional backlight module design is used, then the structure is simple, but it cannot dissipate heat from the display panel effectively
Solution Approach 1:
The patent segments the heat dissipation function into distinct components within the backlight module: a heat sink with specific structural features and a heat conducting device positioned between the display panel and heat sink. This segmentation allows each component to perform its specific thermal management function efficiently, with the heat conducting device transferring heat from hot spots and the heat sink dissipating it to the environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature of heat concentrated areas from above 42° C to below 40° C, enabling the display panel to function as a touch screen and improving the stability and light uniformity of the display device.
Implementation Method 1
a heat conducting device disposed between the heat sink and the display panel to conduct heat generated from the display panel to the heat sink
Implementation Method 2
a heat sink configured to partially accommodate the light guide plate and the light source
Data Source
AI summary
A backlight module suitable for thermal coupling with a display panel includes a light guide plate which has a light incident surface and a light exiting surface, a light source configured such that light emitted therefrom enters the light guide plate from the light incident surface and exits the light guide plate from the light exiting surface to irradiate onto the display panel, a heat sink configured to partially accommodate the light guide plate and the light source, and a heat conducting device disposed between the heat sink and the display panel to conduct heat generated from the display panel to the heat sink. The backlight module can quickly dissipate heat generated from a heat concentrated area of the display panel to the outside.