Backlight Module Heat Sink Airgap Segmentation
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Solution Overview
Problem
Existing backlight modules face inefficiencies in heat dissipation, leading to back plate bending due to inadequate heat management, despite the use of heat sinks.
Innovation Solution
A backlight module design featuring a frame structure with an airgap-defined cover unit, a heat sink located below the airgap, and a light guiding plate supported by a protrusion of the heat sink, which effectively segregates heat and prevents back plate bending by dissipating heat through a horizontal through hole that covers at least 80% of the back plate's length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is added to conduct and dissipate heat, then heat dissipation capability is improved, but heat dissipation efficiency is insufficient to prevent back plate bending
Solution Approach 1:
The heat sink is segmented into multiple heat dissipation fins that extend into the airgap, creating multiple heat dissipation pathways. This segmentation increases the effective heat dissipation surface area and improves thermal management efficiency, preventing back plate bending while maintaining the required temperature control.
Solution Approach 2:
The heat sink extends vertically into the airgap dimension, utilizing the third dimension (depth) for heat dissipation. This dimensional extension allows heat to be dissipated not only horizontally but also vertically through the airgap, significantly enhancing heat dissipation capability and preventing back plate bending.
2Length of stationary object
If the display structure is made thinner, then display thickness is reduced, but heat generated by the light source causes back plate bending
Solution Approach 1:
The heat sink utilizes the airgap dimension (vertical depth) for heat dissipation, allowing effective thermal management in a thin display structure. By extending heat dissipation elements into the airgap, the design achieves adequate heat management without increasing the horizontal footprint or compromising the thin profile of the display.
Solution Approach 2:
The airgap acts as an intermediary thermal management zone between the light source and the back plate. The heat sink positioned in this airgap mediates heat transfer, absorbing and dissipating heat before it can reach the back plate, thus preventing bending while maintaining the thin display structure.
3Temperature
If a heat sink is added to dissipate heat, then heat dissipation structure is improved, but device complexity increases
Solution Approach 1:
The heat sink serves multiple functions: it provides structural support within the airgap, acts as a heat dissipation element, and helps maintain the positioning of other components. This multi-functionality reduces the need for separate structural and thermal management components, thereby reducing overall device complexity while improving heat dissipation efficiency.
Solution Approach 2:
The heat sink is integrated with the existing frame structure and airgap design, merging thermal management functionality with the structural framework. This integration eliminates the need for separate, complex thermal management systems, reducing device complexity while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces heat transfer to the upper side of the back plate, effectively preventing bending and enhancing heat dissipation efficiency.
Implementation Method 1
The heat sink is located below the airgap of the cover unit. The light source directly contacts the heat sink.
Implementation Method 2
The frame structure includes a cover unit that defines an airgap therein. The heat sink is located below the airgap of the cover unit.
Implementation Method 3
The light guiding plate is disposed to correspond in position to the light source for receiving light emitted from the light source, and is supported by the protrusion of the heat sink to be spaced apart from the main body of the heat sink.
Data Source
AI summary
A backlight module includes a frame structure, a heat sink, a light source and a light guiding plate. The frame structure includes a cover unit that defines an airgap therein. The heat sink is located below the airgap of the cover unit. The light source directly contacts the heat sink. The light guiding plate is disposed to correspond in position to the light source for receiving light emitted from the light source. The heat sink is located between the light guiding plate and the cover unit.