Backlight Module Heat Sink Gap Filling
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Solution Overview
Problem
Current side-in type backlight modules face inefficiencies in heat dissipation due to the gap between light sources and reflectors, which limits the ability to manage increasing heat generation as the size of liquid crystal display panels grows, leading to potential reliability issues.
Innovation Solution
Incorporating graphite heat sinks between light sources and reflective sheets, with the heat sinks attached to the reflective sheet and arranged in one-to-one correspondence with the light sources, to enhance heat dissipation by transmitting heat to a backplane and then to the air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of light sources is increased to achieve higher brightness for larger liquid crystal display panels, then the brightness is improved, but the heat generation increases and heat dissipation becomes insufficient
Solution Approach 1:
A heat dissipation sheet is introduced as an intermediary component between the light sources and the reflector. This heat dissipation sheet conducts heat away from the light sources through its thermal conductivity, preventing heat accumulation while maintaining the optical reflection function. The sheet acts as a thermal mediator that separates the heat management function from the optical function.
Solution Approach 2:
The reflector structure is transformed into a multi-functional component by integrating heat dissipation capability into the reflector or the space between the light source and reflector. The same structural element serves both optical reflection and thermal management functions, eliminating the need for separate heat dissipation components.
2Illumination intensity
If the gap between light sources and reflector is maintained for optical performance, then light reflection is optimized, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation sheet serves as a mediator that fills the gap between the light source and reflector. It maintains the necessary optical path while providing a thermal conduction pathway. The intermediary layer enables simultaneous optimization of optical performance and thermal management.
Solution Approach 2:
The heat dissipation sheet is made of materials with specific composite properties - high thermal conductivity for heat dissipation and appropriate optical properties to maintain reflection efficiency. The composite material structure allows the same component to satisfy both thermal and optical requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency by filling the gap between light sources and reflectors, effectively managing heat generated by light emitting diodes and preventing reliability issues associated with inadequate heat management.
Implementation Method 1
heat sinks disposed between the light sources and the reflective sheet... heat generated by the light sources is transmitted to the reflective sheet through the heat sinks, then transmitted to a backplane, and then distributed to the air
Implementation Method 2
a reflective sheet disposed on a reflective surface of the receiving cavity for reflecting light emitted by the light source
Implementation Method 3
The heat sink is a graphite sheet... significantly improves heat dissipation efficiency by filling the gap between light sources and reflectors
Data Source
AI summary
A backlight module. Heat sinks fill gaps between the light sources and the reflective sheet, which greatly improves the heat dissipation efficiency. Current backlight module has no space for a heat sink due to the limitation of the structure space. The invention provides a heat dissipation performance of the backlight module by optimizing to find a relatively unique position to place the heat dissipation material. The invention can effectively and quickly dissipate heat of a light emitting diode (LED) lamp to avoid problems such as reliability analysis (RA) test fluctuations.