Backlight Module Heatsink Plate Thermal Isolation
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Solution Overview
Problem
Current LED backlight modules in liquid crystal display devices suffer from heat dissipation issues, leading to thermal stress, aging, and accuracy problems in optical components due to direct heat conduction from LEDs to backplanes and optical components.
Innovation Solution
A backlight module design featuring a heatsink plate on the outer side of the backplane with an isolating layer and a conduction plate for efficient heat dissipation, where the LED is linked to the heatsink plate through the conduction plate, reducing heat conduction to the backplane and enhancing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the backplane directly contacts optical components to provide structural support, then the structural stability is improved, but the heat conduction to optical components increases causing thermal stress and aging
Solution Approach 1:
The patent introduces a heatsink plate as an intermediary component between the LED and the backplane. The heatsink plate serves as a thermal mediator that conducts heat away from the LED while the isolating layer prevents this heat from reaching the backplane and optical components. This resolves the contradiction by providing a dedicated thermal path that separates structural support functions from thermal management functions.
Solution Approach 2:
The patent segments the thermal management function from the structural support function. The heatsink plate handles thermal conduction for the LED, while the isolating layer creates thermal isolation between the heatsink plate and the backplane. This segmentation allows each component to perform its primary function without interfering negatively with others.
2Device complexity
If the LED is directly mounted on the backplane for simple installation, then the device complexity is reduced, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The heatsink plate acts as a thermal intermediary that enhances heat dissipation efficiency. It provides a dedicated thermal conduction path from the LED to the external environment, preventing heat from being conducted to the backplane. This intermediary component improves heat dissipation without significantly increasing installation complexity.
Solution Approach 2:
The patent extracts the heat dissipation function from the backplane structure. By introducing a separate heatsink plate that extends outward from the backplane, the thermal management function is extracted and dedicated to a specific component, improving heat dissipation efficiency without requiring the backplane itself to be redesigned.
3Volume of stationary object
If the heatsink plate is placed close to the backplane for compact design, then the space utilization is improved, but the thermal isolation effect deteriorates
Solution Approach 1:
The isolating layer serves as a thermal intermediary that provides effective heat isolation in a thin configuration. Placed between the heatsink plate and the backplane, it blocks thermal conduction while occupying minimal space. This maintains compact design while achieving the required thermal isolation effect.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the material between the heatsink plate and backplane. By using a heat-insulating material with low thermal conductivity, the thermal isolation effect is maximized within a thin thickness, achieving both compact design and effective heat blocking.
4Object-affected harmful factors
If the isolating layer thickness is increased to improve heat resistance, then the thermal isolation effect is improved, but the space consumption increases
Solution Approach 1:
The patent optimizes the thickness parameter of the isolating layer to achieve effective heat isolation with minimal space consumption. By carefully selecting the thickness within a specific range, the design achieves sufficient thermal resistance without excessive space consumption.
Solution Approach 2:
The isolating layer is strategically positioned only where thermal isolation is most critical - between the heatsink plate and the backplane. This localized application of thermal insulation provides maximum heat resistance with minimum overall space consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively lowers the temperature of the backlight cavity, reduces temperature gradient, and minimizes thermal expansion and contraction effects on optical components, thereby prolonging their service life and improving display accuracy.
Implementation Method 1
the LED is linked with the heatsink plate in a mode of heat conduction
Implementation Method 2
an isolating layer is arranged between the heatsink plate and the backplane. The isolating layer increases the thermal resistance between the heatsink plate and the backplane
Data Source
AI summary
The utility model discloses a backlight module for a liquid crystal display device and a liquid crystal display device. The backlight module comprises an LED and a backplane, wherein the backlight module also comprises a heatsink plate arranged on the outer of the backplane; and the LED is linked with the heatsink plate in the mode of heat conduction. The utility model, by arranging the LED on an extra heatsink plate which is arranged on the outer of the backplane, dissipates outward the heat emitted by the LED through the heatsink plate, lowers the temperature of the backlight cavity, and protects the optical components. At the same time, because the backplane is not directly used to dissipate heat, the gradient of temperature distribution on the backplane is reduced, thus, the gradient of temperature distribution in the backlight cavity is reduced and stress of the backlight cavity induced by the temperature gradient is also reduced.