Backlight Module Liquid Cooling Heat Dissipation Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional backlight modules, particularly the bottom-lighting type, face challenges with heat dissipation efficiency, leading to uneven temperature distribution and potential deformation of the back bezel, due to the use of heat sinks, external fans, and complex heat pipes that increase thickness and manufacturing costs.
Innovation Solution
A backlight module with a heat dissipation plate featuring fluid channels and a heat dissipation fluid flowing through them, where a back bezel is disposed on the plate, and at least one light source is positioned on the bezel, utilizing a channel forming unit between two plates to create fluid channels for efficient heat dissipation, with a pressure difference maintained by a pressuring device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks and external fans are used for heat dissipation, then heat dissipation capability is improved, but the entire thickness of the backlight module increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing backlight module structure by integrating heat dissipation channels into the housing. Instead of adding separate heat sinks and fans that increase thickness, the cooling function is merged into the modular housing design, allowing heat dissipation without significantly increasing the overall thickness of the backlight module.
Solution Approach 2:
The heat dissipation channels are nested within the housing structure of the backlight module. The channels are formed as cavities or passages within the existing housing components, allowing the cooling system to be contained within the existing thickness constraints rather than adding external heat dissipation components.
2Temperature
If heat pipes with capillary structures are used for heat dissipation, then heat dissipation capability is improved, but manufacturing cost increases due to processing difficulty
Solution Approach 1:
The patent uses a liquid cooling system with pump-driven fluid circulation instead of complex capillary heat pipes. The housing contains channels through which cooling liquid is pumped, providing effective heat dissipation through conventional hydraulic principles that are easier and less costly to manufacture than precision capillary structures.
Solution Approach 2:
The cooling system is designed to be self-regulating through the natural circulation properties of the cooling fluid and passive heat transfer mechanisms. The system automatically adjusts heat dissipation based on thermal conditions without requiring complex control mechanisms or precision-manufactured capillary structures, reducing manufacturing complexity and cost.
3Temperature
If conventional heat dissipation structures are used, then heat dissipation is provided, but uneven temperature distribution occurs causing back bezel deformation
Solution Approach 1:
The housing is divided into multiple separate cooling channels distributed across different regions. This segmentation allows heat to be dissipated from multiple locations simultaneously, preventing concentration of heat in single areas and promoting more uniform temperature distribution across the backlight module and back bezel.
Solution Approach 2:
The cooling channels are strategically positioned and sized to provide localized heat dissipation where needed. Different regions of the housing may have varying channel configurations optimized for local heat generation patterns, ensuring uniform temperature distribution and preventing deformation of the back bezel by addressing thermal issues at their specific locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances heat dissipation efficiency within a limited space, mitigates deformation issues caused by uneven temperature, and improves the overall performance of the backlight module.
Implementation Method 1
a heat dissipation plate including a plurality of fluid channels and a heat dissipation fluid, wherein the heat dissipation fluid flows in the fluid channels
Implementation Method 2
a heat dissipation plate including a plurality of fluid channels and a heat dissipation fluid, wherein the heat dissipation fluid flows in the fluid channels
Data Source
AI summary
The present invention provides a backlight module and a display apparatus. The backlight module comprises a heat dissipation plate, a back bezel and at least one light source. The heat dissipation plate includes a plurality of fluid channels and a heat dissipation fluid, wherein the heat dissipation fluid flows in the fluid channels. The back bezel is disposed on the heat dissipation plate. The at least one light source disposed on the back bezel. The display apparatus comprises the backlight module and a display panel. The present invention can raise the heat dissipation efficiency of the backlight module.