Backlight Module Multi-Tone Photomask Etching Reduction
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Solution Overview
Problem
Current backlight module manufacturing processes for LED display devices are complex and costly due to the need for multiple photomasks and etching processes, leading to increased difficulty and production yield issues.
Innovation Solution
A manufacturing method that uses a multi-tone photomask to simultaneously form an active member and an opening of the bonding terminal, allowing the third conductive layer to form sources, drains, and bonding electrodes, reducing the number of etching times and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple photomasks and multiple wet etching and dry etching processes are used in the driving circuit board manufacturing process, then the manufacturing precision can be improved, but the device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent combines multiple photomask processes and multiple etching steps into a single integrated manufacturing process. Specifically, it uses one photomask process to define both the active member pattern and the bonding terminal opening pattern, and one etching process to simultaneously create both features, thereby reducing process complexity while maintaining manufacturing precision
Solution Approach 2:
The single photomask serves multiple functions by simultaneously defining the active member pattern and the bonding terminal opening pattern. The single etching process also performs multiple functions by creating both the active member structure and the bonding terminal connections in one step
2Adaptability or versatility
If indium tin oxide is used for bonding terminal formation, then the adaptability to low-temperature processes is improved, but the reliability deteriorates due to large resistance and aging issues
Solution Approach 1:
The patent changes the material parameter of the bonding terminal from indium tin oxide to metal material. This parameter change maintains compatibility with low-temperature processes while significantly improving electrical conductivity and long-term stability, thereby resolving the reliability issues associated with indium tin oxide
Data Source
AI summary
A manufacturing method of a backlight module is provided, which includes forming a first conductive layer and a first insulating layer on a substrate, forming an active material layer on the first conductive layer, patterning the first insulating layer and the active material layer by using a multi-tone photomask to expose a portion of the first conductive layer and cause the active material layer to form an active member, and forming a third conductive layer on the active member to form a source and drain of the backlight module.