Backlight Module Press Plate Reduces Thermal Resistance
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Solution Overview
Problem
In LED backlight modules, thermal contact resistance between the heatsink plate and the metal backplane is high due to gaps caused by limited screw attachment points, which hampers heat transfer efficiency.
Innovation Solution
A press plate with a convex structure is attached to the heatsink plate to apply pressure and fill gaps, ensuring tighter contact with the backplane, thereby reducing thermal resistance and enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heatsink plate is attached to the metal backplane by screws at limited attachment points, then the attachment is simple and easy to manufacture, but large gaps exist between the heatsink plate and backplane in areas without screws, resulting in high thermal contact resistance and poor heat transfer
Solution Approach 1:
The patent introduces a press plate as an intermediary component between the heatsink plate and the metal backplane. This press plate applies continuous pressure across the entire contact surface, filling gaps and ensuring intimate contact between the heatsink plate and backplane, thereby eliminating thermal contact resistance caused by limited screw attachment points while maintaining manufacturing simplicity
Solution Approach 2:
The patent changes the pressure distribution parameter by introducing a press plate that applies uniform or controlled pressure across the heatsink plate-backplane interface. This parameter change transforms the discontinuous pressure distribution (only at screw points) into continuous pressure distribution, significantly improving thermal contact and heat transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance and improves heat transfer efficiency by ensuring uniform pressure distribution and tighter contact between the heatsink plate and the backplane, leading to faster heat dissipation.
Implementation Method 1
the press plate is attached to the heatsink plate to tightly press the heatsink plate against the backplane
Implementation Method 2
thermal contact resistance exists in the contact interface between the heatsink plate and the backplane, which influences the heat transfer
Implementation Method 3
use a heatsink plate to transfer the heat generated by the PN junction of the LED to a metal backplane
Implementation Method 4
the heat is dissipated through heat convection between the backplane and the outside
Data Source
AI summary
The present invention discloses a backlight module and a liquid crystal display (LCD) thereof. The backlight module comprises a backplane and a heatsink plate attached to the backplane, and the backlight module of the LCD also comprises at least one press plate, wherein the press plate is attached to the heatsink plate to tightly press the heatsink plate against the backplane. Because a press plate is added in the present invention to tightly press the heatsink plate, the press plate reduces the gaps formed between the places away from the attaching points because of small pressure. Therefore, thermal contact resistance is reduced, the heat in the cavity of the backlight is conducted to the metal backplane in time, and the temperature of the backlight module is reduced.