Backlight Module Protrusion Heat Conduction

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Solution Overview

Problem

The heat dissipation in LED-based liquid crystal displays (LCDs) is inefficient due to high thermal resistance caused by poor heat conduction materials like glue layers and metal steel backplanes, leading to elevated junction temperatures, especially in high-brightness outdoor applications.

Innovation Solution

A backlight module design featuring a PCB with protrusions that penetrate through grooves in the backplane, allowing direct heat conduction and reducing thermal resistance, thereby improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional backlight module structure with glue layer and metal steel backplane is used, then manufacturing cost is reduced and assembly is simplified, but thermal resistance increases and heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveassembly simplicityVSAvoidjunction temperature

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The invention extracts and removes the thermal bottleneck components (glue layer and metal steel backplane) from the heat conduction path. By eliminating these high thermal resistance layers, the patent achieves direct heat conduction from LED chips to the aluminum alloy backplane, significantly reducing junction temperature while maintaining manufacturing simplicity

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention employs composite material strategy by using aluminum alloy backplane with superior thermal conductivity properties. The backplane integrates multiple functional layers including reflective layer, diffusion layer, and protective layer, creating a composite structure that optimizes both thermal management and optical performance while maintaining ease of manufacture

Inventive Principle:

Principle #40Composite materials

2Device complexity

If fewer LED lamps are used to reduce manufacturing cost, then device complexity is reduced, but heat dissipation becomes more difficult due to higher power per LED

Engineering Contradiction:

Improvenumber of LED lampsVSAvoidheat generation

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The invention changes the thermal conductivity parameter of the backplane material from metal steel to aluminum alloy, which has superior heat dissipation properties. This parameter change enables fewer LED lamps to be used while maintaining effective heat dissipation, as the aluminum alloy backplane can handle higher power density per LED without excessive temperature rise

Inventive Principle:

Principle #35Parameter changes

3Illumination intensity

If high power LED lamps (1.5W-2W) are used to achieve high brightness, then the number of LEDs is reduced, but junction temperature increases to 96°C

Engineering Contradiction:

Improvedisplay brightnessVSAvoidLED service life

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The invention converts the harmful heat generated by high power LED lamps into a manageable thermal flow by designing an optimized aluminum alloy backplane with integrated heat dissipation structures. The reflective layer redirects light while the backplane conducts heat away, transforming the heat problem into an efficient thermal management solution that maintains LED reliability at high brightness levels

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The aluminum alloy backplane acts as an intermediary between the LED chips and the external environment. It provides a thermal bridge that conducts heat away from the LED junctions while maintaining structural integrity and optical functions, thereby protecting the LEDs from excessive temperature while achieving high brightness output

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces junction temperatures and enhances the radiating efficiency of the backlight module, prolonging the service life of the LCD by facilitating quicker heat removal from LED chips.

Implementation Method 1

The protrusion includes a convex bar or a plurality of convex columns and penetrates through the backplane to facilitate heat conduction

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS10824007B2Light bar, backlight module and liquid crystal display

Publication Date: 2020.11.03 HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD

AI summary

A light bar, a backlight module and a liquid crystal display are provided. The backlight module includes the light bar and a backplane, the light bar includes a PCB, a plurality of LED chips arranged on a surface of the PCB and a protrusion arranged on the other surface of the PCB, and the backplane includes a baseboard defining a through groove. The protrusion on the PCB is inserted into the through groove of the backplane to facilitate heat conduction. In this way, heat generated by the LED chips could be conducted out quickly.