Backlight Module Reflective Pattern With Pad Openings
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Solution Overview
Problem
Conventional direct-lit light-injection schemes in backlight modules suffer from reduced brightness due to the necessity of a forbidden region around soldering pads, which limits the size of the reflective layer and thus reduces the reflectivity.
Innovation Solution
Incorporating a reflective pattern layer with openings corresponding to the positions of soldering pads, where the opening size is smaller than the pad size, allowing light-emitting diode chips to be electrically connected through these openings, thereby increasing the reflective layer's coverage and brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is provided at positions where light-emitting diodes and pads are not provided, then brightness is improved, but a forbidden region must be defined around the pad to avoid process error, which decreases the ratio of the reflective layer and lowers brightness
Solution Approach 1:
The reflective pattern layer is designed with spatially varying properties: it provides full reflective coverage in most areas while creating localized openings at pad positions. This allows the reflective layer to maintain high brightness in non-pad regions while ensuring process reliability by exposing pads through openings, eliminating the need for forbidden regions.
Solution Approach 2:
The reflective pattern layer is segmented into reflective regions and opening regions. The openings are strategically positioned at pad locations, allowing the reflective layer to be divided into functional zones that simultaneously achieve high brightness and process reliability without requiring a complete forbidden region around pads.
2Reliability
If a forbidden region is defined around the pad to avoid process error, then reliability is improved, but the ratio of the reflective layer decreases, thereby lowering the brightness
Solution Approach 1:
Instead of creating a forbidden region around pads to ensure reliability (conventional approach), the patent inverts the strategy by creating openings at pad positions within the reflective pattern layer. This inversion allows the reflective layer to extend closer to and around pads without causing process errors, thereby maintaining both reliability and high brightness.
3Illumination intensity
If the opening size is made smaller than the pad size, then the reflective layer coverage is increased and brightness is improved, but the electrical connection through openings must be ensured
Solution Approach 1:
The opening size parameter is optimized to be smaller than the pad size, striking a balance between maximizing reflective layer coverage for brightness and maintaining sufficient opening dimensions for reliable electrical connection. This parameter optimization ensures both high brightness performance and manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the brightness of the backlight module and liquid crystal display by maximizing the reflective layer's coverage without the need for a forbidden area, leading to improved display performance.
Implementation Method 1
the reflective pattern layer covers the plurality of soldering pads and the substrate, wherein the reflective pattern layer has a plurality of openings
Data Source
AI summary
A backlight module and a liquid crystal display are provided. The backlight module has a substrate, a plurality of soldering pads, and a reflective pattern layer. The soldering pads are distributed on the substrate and each of the soldering pads has a soldering pad size. The reflective pattern layer covers the soldering pads and the substrate. The reflective pattern layer has openings, positions of the openings correspond to positions of the soldering pads, each of the openings has an opening size, and the opening size is smaller than the corresponding soldering pad size. The backlight module is provided with the openings in the reflective pattern corresponding to the positions of the soldering pads, and the opening size of the openings is smaller than the soldering pad size of the soldering pads, thereby increasing a ratio of the reflective pattern layer to the substrate. Therefore, brightness is improved.