Backlight Module Rubber Frame Heat Dissipation
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Solution Overview
Problem
The uneven heat distribution between integrated circuits (ICs) and light-emitting diodes (LEDs) in display devices leads to deformation and folding of the layer structure due to inadequate heat dissipation, particularly with the use of LEDs with low light conversion efficiency and high heat generation.
Innovation Solution
A backlight module is designed with a rubber frame, a reflective film spaced apart from an optical component by an adhesive, and a heat-conductive film layer, along with a blocking wall and groove structure to enhance heat dissipation, preventing heat superposition and maintaining uniform heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs with low light conversion efficiency are used to achieve high color gamut, then display quality is improved, but heat generation increases
Solution Approach 1:
The patent extracts the harmful heat away from the display device by introducing a dedicated heat dissipation chamber that isolates and channels heat from LEDs and ICs into a separate space, allowing heat to be removed without affecting display quality
Solution Approach 2:
The patent introduces heat dissipation channels and thermal management structures as intermediary elements between the heat-generating components (LEDs and ICs) and the display layers, mediating heat transfer away from sensitive areas
2Temperature
If heat dissipation structures are added to improve heat dissipation, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The rubber frame serves multiple functions: it provides structural support for the display device, creates the heat dissipation chamber, and acts as a thermal management component, thereby improving heat dissipation without adding separate structural elements
Solution Approach 2:
The patent merges the heat dissipation function with existing structural components by forming the heat dissipation chamber within the rubber frame and integrating heat dissipation channels into the frame structure, avoiding additional complex components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation in the backlight module, preventing deformation and fold issues in the display device's layer structure, allowing for the development of thinner, high-definition displays with improved LED performance.
Implementation Method 1
the reflective film is fixed to the rubber frame through the adhesive, to space the reflective film apart from the optical component by a predetermined interval
Implementation Method 2
a heat-conductive film layer arranged at a back side of the light bar
Data Source
AI summary
A backlight module and a display device are provided. The backlight module includes: a rubber frame, a reflective film and an optical component. The optical component is arranged at a receiving region formed on the top of the rubber frame, the rubber frame is provided with an adhesive at the bottom, and the reflective film is fixed to the rubber frame through the adhesive to space the reflective film apart from the optical component by a predetermined interval.