Backlight Module Rubber Frame Heat Dissipation
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Solution Overview
Problem
The uneven heat distribution between integrated circuits (ICs) and light-emitting diodes (LEDs) in display devices leads to deformation and folding of the layer structure, necessitating improved heat dissipation capabilities.
Innovation Solution
A backlight module is designed with a rubber frame, a reflective film, and an optical component, where the reflective film is fixed to the rubber frame through an adhesive to create a predetermined interval, allowing for effective heat dissipation and preventing heat superposition between the ICs and LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LEDs are increased to achieve high definition and narrow bezel, then display quality is improved, but heat emission increases causing uneven heat distribution
Solution Approach 1:
The patent extracts the harmful heat from the system by providing dedicated heat dissipation pathways. The first heat dissipation structure removes heat from the LED side while the second heat dissipation structure removes heat from the IC side, preventing heat accumulation and uneven distribution that would otherwise compromise display quality.
2Temperature
If heat dissipation structures are added to improve heat dissipation, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with existing structural elements. The heat dissipation structures are integrated into the housing and mounting arrangements, combining thermal management with mechanical support functions. This approach improves temperature uniformity without proportionally increasing device complexity, as the same structural components serve multiple purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, preventing deformation and fold issues in the layer structure by ensuring uniform heat distribution, thereby supporting the development of thinner, high-definition display devices with improved LED performance.
Implementation Method 1
the reflective film is fixed to the rubber frame through the adhesive, to space the reflective film apart from the optical component by a predetermined interval... so that the heat generated by the light bar of the optical component is dissipated in the interval
Data Source
AI summary
A backlight module and a display device are provided. The backlight module includes: a rubber frame, a reflective film and an optical component. The optical component is arranged at a receiving region formed on the top of the rubber frame, the rubber frame is provided with an adhesive at the bottom, and the reflective film is fixed to the rubber frame through the adhesive to space the reflective film apart from the optical component by a predetermined interval.