Backlight Module Thermal Buffer for Reflective Member Deformation
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Solution Overview
Problem
The existing backlight modules suffer from non-uniform light emission due to direct contact between the heat sink and the reflective member, leading to irregular deformation and heat transfer, which affects the display quality of liquid crystal displays.
Innovation Solution
Incorporating thermal buffer members with lower thermal conductivity between the heat sink and the reflective member, and using heat dissipating grooves and thermal conductive adhesive tapes to manage heat dissipation, thereby reducing heat transfer to the reflective member and minimizing its deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat sink is in direct contact with the reflective member, then heat dissipation efficiency is improved, but the reflective member deforms irregularly due to heat transfer
Solution Approach 1:
A thermal buffer member is introduced as an intermediary component between the heat sink and the reflective member. This thermal buffer member has lower thermal conductivity than the heat sink, which blocks excessive heat transfer to the reflective member while still allowing adequate heat dissipation from the light source, thereby preventing irregular deformation of the reflective member.
2Shape
If thermal buffer members are added between the heat sink and reflective member, then reflective member deformation is reduced, but device complexity increases
Solution Approach 1:
The thermal buffer member is strategically placed only at the interface between the heat sink and reflective member where heat transfer causes deformation, rather than throughout the entire structure. This localized approach addresses the specific problem of reflective member deformation without unnecessarily complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the uniformity of light emission by reducing heat transfer to the reflective member, leading to improved display quality and reduced deformation, resulting in a more uniform backlight module.
Implementation Method 1
a heat sink located above a backplane for dissipating heat generated by a light source
Implementation Method 2
a first surface of the heat sink adjacent to the reflective member defines at least one first heat dissipating groove
Implementation Method 3
one or more thermal buffer members disposed between the heat sink and the reflective member, wherein a thermal conductivity coefficient of each of the thermal buffer members in a direction perpendicular to a light exiting surface of the backlight module is less than that of the heat sink
Implementation Method 4
a reflective member disposed on a side of a light guide plate adjacent to the backplane
Data Source
AI summary
The present disclosure provides a backlight module and a display device, and relates to the field of display technology. The backlight module includes: a heat sink located above a backplane for dissipating heat generated by a light source; a reflective member disposed on a side of a light guide plate adjacent to the backplane; and one or more thermal buffer members disposed between the heat sink and the reflective member, wherein a thermal conductivity coefficient of each of the thermal buffer members in a direction perpendicular to a light exiting surface of the backlight module is less than that of the heat sink.