Backlight Module Thermal Chamber Air Flow Design
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Solution Overview
Problem
Current backlight modules for liquid crystal displays face challenges with heat dissipation due to complex structures and high costs associated with aluminum extrusion heat dissipation methods, which increase thermal resistance and require additional operations and materials.
Innovation Solution
A backlight module design featuring a thermal chamber with a penetrating hollow structure and openings in the aluminum extrusion allows for direct mounting of LEDs on its surface, forming a channel for air flow to enhance heat dissipation and reduce thermal resistance interfaces, while eliminating the need for forming a light bar and bonding to an aluminum extrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum extrusion heat dissipation is adopted, then heat dissipation performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the heat dissipation function with the backlight module housing by integrating a thermal chamber directly into the aluminum extrusion structure. The thermal chamber is formed as a hollow cavity within the aluminum extrusion, combining structural support and heat dissipation functions into a single integrated component, thereby reducing overall device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The aluminum extrusion is segmented into functional zones: a thermal chamber for heat dissipation, mounting areas for LED light sources, and extension plates for increased surface area. This segmentation allows each portion to perform its specific function optimally while maintaining a modular design that simplifies manufacturing.
2Temperature
If aluminum extrusion heat dissipation is adopted, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
By combining the heat dissipation structure with the backlight module housing, the patent eliminates the need for separate aluminum extrusion components and reduces assembly steps. The integrated design allows for single-piece manufacturing or simplified assembly processes, thereby reducing manufacturing costs while maintaining heat dissipation effectiveness.
Solution Approach 2:
The aluminum extrusion serves multiple functions: structural support for the backlight module, heat dissipation pathway through the thermal chamber, and mounting surface for LED lights. This multi-functionality reduces the need for additional components and assembly operations, thereby lowering manufacturing costs.
3Illumination intensity
If light bar is formed by packaging LEDs and MCPCB, then light emission is achieved, but additional operations and thermal resistance interfaces are introduced
Solution Approach 1:
The patent extracts the LED light sources directly from the packaging process and mounts them individually onto the thermal chamber structure. This eliminates the need to form a complete light bar assembly first, then bond it to the aluminum extrusion, thereby reducing assembly operations and thermal resistance interfaces while maintaining light emission functionality.
Solution Approach 2:
Instead of the conventional approach of assembling LEDs into a light bar first and then mounting to the heat dissipation structure, the patent inverts the sequence by directly mounting LEDs to the thermal chamber surface. This reversal of the assembly sequence simplifies the manufacturing process and reduces the number of thermal resistance interfaces.
4Temperature
If light bar is bonded to aluminum extrusion, then heat dissipation is achieved, but thermal resistance interface increases
Solution Approach 1:
The patent extracts the bonding step from the assembly process by directly mounting LED light sources to the thermal chamber surface, eliminating the intermediate light bar component. This removes the thermal resistance interface that would otherwise exist between the light bar and aluminum extrusion, improving thermal conduction efficiency.
Solution Approach 2:
The patent inverts the conventional assembly sequence by directly mounting LEDs to the thermal chamber rather than assembling a light bar first. This reversal eliminates the bonding interface between light bar and aluminum extrusion, reducing thermal resistance and improving heat dissipation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation performance, reduces material usage, and lowers assembly costs by simplifying the structure and increasing the contact surface area for heat transfer, thereby extending the lifespan of LEDs and enhancing light emission efficiency.
Implementation Method 1
forms a channel for air flow to enhance heat dissipation performance
Implementation Method 2
aluminum extrusion forms at least one thermal chamber
Implementation Method 3
The extension plate expands a contact area with surrounding air
Implementation Method 4
a heat dissipation layer capable of radiation heat dissipation is formed
Data Source
AI summary
The present invention discloses a backlight module, which includes a light source and an aluminum extrusion. The aluminum extrusion forms at least one thermal chamber. The thermal chamber is a penetrating hollow structure having an opening. The present invention also discloses a liquid crystal display device having the backlight module. Practicing the backlight module of the present invention and the liquid crystal display device using the backlight module allows a channel for air flow to be formed in the interior of the thermal chamber to enhance heat dissipation performance, eliminate the operations of forming a light bar through packaging the light source and an MCPCB and bonding the light bar to the aluminum extrusion, decrease thermal resistance interface, and saves assembling material.