Backlight Module Thermo-Sensitive Heat Conduction Material
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Solution Overview
Problem
Conventional LED backlight modules face challenges in heat dissipation due to air thermal resistance and low thermal conductivity of adhesive tapes, leading to temperature imbalance and increased processing costs, which can result in abnormal display issues.
Innovation Solution
A backlight module utilizing a thermo-sensitive heat conduction material with a negative coefficient that adjusts thermal conductivity exponentially with temperature, ensuring temperature uniformity by varying thermal conductivity coefficients across the light bar, eliminating the need for special bracket processing and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fastening is done with bolt or heat dissipative adhesive tapes, then the light bar is securely mounted, but air thermal resistance increases and heat dissipation performance decreases
Solution Approach 1:
The patent introduces a heat dissipation bracket as an intermediary component between the light bar and the backboard. This bracket serves as a thermal conductor that directly contacts both the light bar and the backboard, eliminating air thermal resistance and providing efficient heat dissipation while maintaining secure mounting.
Solution Approach 2:
The patent replaces the mechanical fastening system (bolts or adhesive tapes) with a thermal conduction system using a heat dissipation bracket. This substitution eliminates the air gaps created by mechanical fastening methods and provides continuous thermal contact for improved heat dissipation.
2Ease of manufacture
If conventional adhesive tapes are used for heat dissipation, then mounting is simple, but thermal conductivity coefficient is low and heat dissipation performance is severely affected
Solution Approach 1:
The heat dissipation bracket acts as an intermediary that provides superior thermal conduction compared to adhesive tapes. It maintains the simplicity of mounting while dramatically improving heat dissipation by providing direct thermal contact between the light bar and backboard.
3Temperature
If special processing is applied to the bracket for temperature balance, then temperature uniformity is improved, but processing cost increases
Solution Approach 1:
The patent changes the thermal conductivity parameter of the bracket by using a material with high thermal conductivity. This material parameter change enables the bracket to naturally balance temperature across its structure without requiring special processing, thereby maintaining temperature uniformity while reducing manufacturing costs.
Solution Approach 2:
The bracket is designed with extended portions positioned at specific locations (such as near LED light bars) to provide localized heat dissipation where it is most needed. This local quality enhancement achieves temperature balance without requiring complex processing of the entire bracket.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls temperature within a predetermined range, ensuring uniform heat dissipation and preventing luminance lowering, while reducing assembly complexity and costs by enhancing thermal conductivity and contact engagement between the light bar and the backboard or bracket.
Implementation Method 1
a thermo-sensitive heat conduction material interposed between the backboard and the light bar... thermal conductivity coefficient that decreases in exponential form with increase of temperature
Implementation Method 2
heat conduction blocks 2 mounted to the backboard 1... heat pipe 3 has a high temperature end that is set in contact with the heat conduction block 2
Implementation Method 3
The heat pipe 3 has a high temperature end that is set in contact with the heat conduction block 2. A low temperature end of the heat pipe 3 is set at a location distant from the LED light bars 4 and is in contact with the backboard 1
Data Source
AI summary
The present invention provides a backlight module, which includes a backboard, a light bar mounted on the backboard, and a thermo-sensitive heat conduction material interposed between the backboard and the light bar. The thermo-sensitive heat conduction material functions to automatically adjust thermal conductivity coefficient with variation of temperature so that different portions of the light bar have different thermal conductivity coefficients in order to control the temperature of the whole light bar in a predetermined range to ensure desired performance of thermal conduction and further ensuring temperature uniformity of the whole backlight module and preventing the occurrence of luminance lowering of the whole backlight module due to excessive local high temperature.