Backlight Module Thermoelectric Heat Dissipation
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Solution Overview
Problem
Current backlight modules for LCD devices suffer from low heat dissipation efficiency, leading to performance degradation and color deviation in LED lights and quantum dot light emitting diodes due to high temperatures, with no effective heat dissipation schemes available.
Innovation Solution
A backlight module incorporating a combination of thin-film thermoelectric devices and bulk thermoelectric devices, where the thin-film devices are mounted on a frame with a heat conductive layer, and the bulk devices are connected to the thin-film devices, enhancing heat transfer and dissipation efficiency, and an energy storage device is used to recycle residual heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED lights are used as backlight for long working process, then illumination is provided, but heat accumulates causing performance degradation and color deviation
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional backlight structure by introducing a dedicated thermoelectric device. This device is mounted on the frame and thermally coupled to the LED light, actively extracting heat from the LED and transferring it to the frame, thereby resolving the heat accumulation problem while maintaining illumination performance
Solution Approach 2:
The frame serves multiple functions: it provides structural support for the backlight module, acts as a heat sink to dissipate heat from the thermoelectric device, and serves as a mounting platform for the thermoelectric device itself. This multi-functionality integrates heat dissipation into the existing structure without adding significant complexity
2Illumination intensity
If quantum dot light emitting diodes are used, then color performance is improved, but quantum dots are quenched at high temperatures
Solution Approach 1:
The thermoelectric device actively extracts heat from the QLED before it can reach temperatures that cause quantum dot quenching. By providing a dedicated heat extraction path to the frame, the operating temperature of the QLED is maintained at safe levels, preserving color performance and preventing degradation
3Duration of action of moving object
If high temperature occurs in backlight module, then LED operation is maintained, but liquid crystal deflections are affected causing abnormal phenomena
Solution Approach 1:
The thermoelectric device acts as an intermediary between the LED light and the frame, providing a controlled thermal management interface. It actively regulates the temperature by pumping heat from the LED to the frame, preventing temperature-induced liquid crystal deflections and abnormal phenomena while maintaining continuous LED operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency by transferring heat to the bulk thermoelectric devices, achieving effective heat dissipation and recycling residual heat for reuse, thereby enhancing the performance and lifespan of the backlight module.
Implementation Method 1
The thermoelectric devices realize temperature difference power generation and electric refrigeration based on the Seebeck effect and the Peltier effect of materials respectively
Implementation Method 2
The thermoelectric devices realize temperature difference power generation and electric refrigeration based on the Seebeck effect and the Peltier effect of materials respectively
Implementation Method 3
a first heat conductive layer disposed on a surface of the thin-film thermoelectric device set away from a side of the frame; a second heat conductive layer disposed between the bulk thermoelectric device set and the frame
Data Source
AI summary
A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a frame, a thin-film thermoelectric device set, a first heat conductive layer, a light emitting diode (LED) light, a bulk thermoelectric device set, and a second heat conductive layer. The manufacturing method for backlight module includes a device preparing step, a thin-film thermoelectric device set mounting step, a first heat conductive layer preparing step, an LED light mounting step, a bulk thermoelectric device set mounting step, and a bulk thermoelectric device set mounting step. The technical effect of the invention is to realize the heat dissipation and the recovery and utilization function of the waste heat.