Backlight Module With Through-Hole Baseboard For Heat Dissipation

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Solution Overview

Problem

Existing backlight modules face inefficiencies in heat dissipation due to high thermal resistance in the isolating material of the metal circuit board, leading to increased costs and panel thickness, and complex wire arrangements that complicate manufacturing and maintenance.

Innovation Solution

A backlight module design featuring a baseboard with through-holes for direct contact between light-emitting elements and heat-dispersing fins, utilizing thermally conductive and electrically insulating materials to enhance heat transfer, and integrating circuits on a single baseboard to simplify wire arrangements and reduce thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If isolating material is used in the metal circuit board, then electrical insulation is achieved, but thermal resistance increases and heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveelectrical insulationVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The invention divides the heat dissipation path into two independent channels: (1) electrical insulation function is performed by the isolating material layer, while (2) heat dissipation is achieved through thermally conductive protrusions that bypass the isolating material. This segmentation allows each component to specialize in its primary function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermally conductive protrusions act as intermediary elements that bridge the gap between the light-emitting element and the heat dispersing portion. These protrusions provide a dedicated thermal conduction path through the isolating material layer, enabling heat to transfer efficiently while maintaining electrical insulation integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple substrates and circuit boards are assembled separately, then circuit functionality is achieved, but manufacturing complexity and labor increase

Engineering Contradiction:

Improvecircuit functionalityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention merges the substrate and circuit board into a single integrated structure where the circuit board serves dual purposes: as the mounting substrate for light-emitting elements and as the heat dispersing portion. This consolidation eliminates the need for separate assembly steps and reduces manufacturing complexity while maintaining full circuit functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If traditional wire arrangement is used for connecting circuits, then electrical connectivity is achieved, but maintenance difficulty and space consumption increase

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmaintenance difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of repair

Solution Approach 1:

The invention replaces the mechanical wire connection system with direct electrical traces printed on the circuit board. This substitution eliminates the need for physical wire assembly, reduces space consumption, and significantly improves maintainability by simplifying the electrical connectivity structure to integrated circuit traces that are inherently more reliable and easier to repair.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Adaptability or versatility

If substrate and metal circuit board are arranged separately, then functional requirements are met, but display panel thickness increases

Engineering Contradiction:

Improvefunctional requirementsVSAvoidpanel thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The invention combines the substrate and metal circuit board into a single integrated component where the circuit board simultaneously serves as both the mounting substrate and the heat dispersing structure. This merger eliminates the need for separate arrangement of these components, thereby reducing the overall panel thickness while maintaining all required functions.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat dissipation efficiency, reduces manufacturing costs, and minimizes panel thickness by eliminating unnecessary media and integrating circuits, while ensuring even illumination and efficient heat dispersion.

Implementation Method 1

heat generated by the light-emitting elements can be transferred to the heat-dispersing fins directly to increase the heat-dispersing efficiency

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7374316B2Backlight module

Publication Date: 2008.05.20 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD

AI summary

A backlight module comprises a baseboard, at least one light-emitting element and a heat-dispersing member. The baseboard has at least one through-hole. The light-emitting element is installed in one of the through-holes and is electrically connected to a surface of the baseboard. The heat-dispersing member adjacent to the baseboard can contact the light-emitting elements directly.