Backlight Module Transparent Heat Dissipation Layer Thermal Coupling
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Solution Overview
Problem
The increasing demand for higher resolution and brightness in Micro/Mini LED displays leads to increased thermal coupling between LEDs due to shrinking distances and higher driving currents, making effective heat dissipation challenging.
Innovation Solution
A backlight module with a transparent film heat dissipation layer made of graphene or other thermally conductive materials placed between adjacent LEDs on the drive substrate to absorb and dissipate heat, reducing thermal coupling and improving thermal stability while maintaining high light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of LEDs per unit area is increased to improve resolution and brightness, then the display quality is improved, but the thermal coupling effect between adjacent LEDs increases and heat dissipation becomes difficult
Solution Approach 1:
A transparent heat dissipation layer is introduced as an intermediary substance between adjacent LEDs. This layer serves as a thermal conductor that provides heat dissipation pathways, reducing the thermal coupling effect while maintaining the optical performance needed for high brightness display quality.
Solution Approach 2:
The heat dissipation layer is specifically positioned in the regions between adjacent LEDs where thermal coupling occurs. By applying the heat dissipation function locally at the interfaces between LEDs rather than uniformly across the entire display, the patent effectively addresses thermal coupling at its source while preserving LED optical characteristics.
2Measurement precision
If the distance between LEDs is reduced to increase the number of LEDs per unit area, then the resolution is improved, but the thermal coupling effect intensifies
Solution Approach 1:
The transparent heat dissipation layer acts as a thermal mediator inserted in the reduced spaces between closely-spaced LEDs. This intermediary structure enables effective heat management even when LEDs are positioned at minimal distances, allowing high resolution to be achieved without excessive thermal coupling.
Solution Approach 2:
The patent changes the thermal parameters of the interface region between LEDs by introducing the heat dissipation layer. This modifies the thermal conductivity and heat distribution characteristics in the critical regions where LEDs are closely spaced, enabling resolution improvement while controlling thermal effects.
3Illumination intensity
If the driving current of a single LED is increased to improve brightness, then the luminous output is improved, but the calorific value of the LED increases
Solution Approach 1:
The patent converts the harmful thermal energy (calorific value) generated by high driving currents into a manageable parameter by providing dedicated heat dissipation pathways. The transparent heat dissipation layer captures and redirects the waste heat, transforming it from a detrimental byproduct into a controlled thermal management issue, thereby enabling sustained high brightness operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal coupling between LEDs, enhances heat dissipation, and maintains optical performance, leading to improved thermal stability and longer service life of the display device.
Implementation Method 1
a first heat dissipation layer disposed on the first side of the drive substrate and between adjacent light sources, the first heat dissipation layer being a transparent film
Data Source
AI summary
A backlight module includes a drive substrate and a plurality of light sources. The drive substrate has a first side on which the plurality of light sources are provided at intervals. The backlight module further includes a first heat dissipation layer. The first heat dissipation layer is a transparent film and disposed on the first side of the drive substrate and located between adjacent light sources, to be directly in contact with the light sources, so as to block the light sources and absorb the heat of the light source and radiate heat, which is beneficial for reducing or eliminating the thermal coupling between adjacent light sources and helping the first side of the drive substrate to dissipate heat, so that the designed backlight module has better thermal stability and longer service life.