Backlight Module Heat Dissipation via Integrated PCB Conduction

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Solution Overview

Problem

Conventional heat dissipation structures for backlight modules are too large, costly, and lack electrical isolation, leading to potential short circuits and design challenges, especially with increasing LED power requirements.

Innovation Solution

A heat dissipation structure integrated into a circuit board with a heat-conductive element and thermally conductive glue, featuring through holes filled with heat-conductive material and electrical isolation, allowing for efficient heat transfer and electrical connectivity without increasing size or cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional aluminum substrate or fins are used for heat dissipation, then heat dissipation capability is improved, but the size of the backlight module becomes too large

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidsize of backlight module

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent merges the heat dissipation function with the circuit board structure by integrating heat-conductive layers and through-holes directly into the circuit board. This eliminates the need for separate aluminum substrates or fins, achieving both heat dissipation and structural integration without increasing the overall module size.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from surface-level heat dissipation (using fins on the surface) to volumetric heat dissipation by creating through-holes that penetrate the entire circuit board thickness. This three-dimensional heat conduction path allows efficient heat removal without increasing the surface area or overall dimensions of the module.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If aluminum substrate is used for heat dissipation, then heat dissipation capability is improved, but fabrication cost and design difficulty increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidfabrication cost and design difficulty

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent combines the heat dissipation function with the existing circuit board structure, eliminating the need for separate aluminum substrates. This integration reduces material costs and simplifies the manufacturing process by using standard PCB fabrication techniques to create heat-conductive layers and through-holes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces expensive aluminum substrates with cost-effective circuit board materials that can be manufactured using standard PCB processes. The heat-conductive layers and through-holes are created within the existing circuit board structure, avoiding the need for costly specialized materials while maintaining adequate heat dissipation performance.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Temperature

If conventional heat dissipation structure is used, then heat dissipation capability is improved, but electrical isolation between heat-dissipating and electrically conductive paths is lacking, causing potential short circuits

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidelectrical isolation and short circuit prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent segments the circuit board into distinct functional layers: heat-conductive layers for thermal management and electric circuit layers for electrical connectivity. By separating these functions into different layers and using insulating materials at interfaces, the patent achieves both effective heat dissipation and reliable electrical isolation, preventing potential short circuits between the two functions.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective heat dissipation, electrical isolation, and reduced fabrication costs, meeting the requirements of smaller, lighter products while preventing short circuits.

Implementation Method 1

each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7505109B2Heat dissipation structure of backlight module

Publication Date: 2009.03.17 AU OPTRONICS CORP

AI summary

The heat dissipation structure of the backlight module of the present invention comprises a circuit board, a heat-conductive element (such as thermally conductive glue) and a light-emitting diode (LED) chip, wherein the circuit board has an electric circuit layer and a heat conductive layer respectively formed on two opposite surfaces thereof. The circuit board has a plurality of through holes penetrating through the electric circuit layer and the heat-conductive layer of the circuit board, wherein each of the through holes is filled with heat-conductive material. The heat-conductive element is placed on the circuit layer and covers the through holes, and the LED chip is disposed on the heat-conductive element and is electrically connected to the electric circuit layer.