Backlight Assembly Heat Dissipation via Angled Receiving Member

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Backlight assemblies using LEDs for liquid crystal displays face challenges with heat radiation, as they dissipate most energy as heat, leading to increased costs, weight, and size when traditional heat radiation members are employed.

Innovation Solution

The design incorporates a receiving member with angled walls and through holes or uneven patterns to enhance heat dissipation without the need for separate heat radiation members, allowing for efficient heat transfer and dissipation through the PCB and heat radiation pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat radiation member (heat pipe, heat sink, or fan) is used to improve heat radiation from the LED, then the temperature of the backlight is reduced, but the cost and/or the weight and size increase

Engineering Contradiction:
Improvebacklight temperatureVSAvoidbacklight assembly weight
Core Design Contradiction:
TemperatureVSWeight of stationary object

Solution Approach 1:

The receiving member integrates multiple functions: it serves as the structural support for the LED, the heat radiation structure, and the mounting platform. By merging the heat radiation function into the receiving member itself rather than adding a separate heat radiation component, the patent eliminates the need for additional weight while maintaining effective heat dissipation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The receiving member is designed to perform multiple functions simultaneously: mechanical support for the LED, heat conduction pathway, and heat radiation interface. This multi-functional design eliminates the need for separate dedicated heat radiation components, thereby reducing overall weight.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If a heat radiation member is added to improve heat radiation, then the temperature is reduced, but the size of the backlight assembly increases

Engineering Contradiction:
Improvebacklight temperatureVSAvoidbacklight assembly size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The heat radiation function is merged into the receiving member structure itself. The receiving member includes integrated features such as heat conduction pathways and radiation surfaces that are part of its primary structure, eliminating the need for additional separate heat radiation components that would increase volume.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the vertical dimension and surface area of the receiving member to enhance heat radiation. By designing the receiving member with optimized thermal pathways and radiation surfaces in three-dimensional space, effective heat dissipation is achieved without increasing the overall footprint or volume of the backlight assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If a heat radiation member is installed to improve heat radiation, then the temperature is reduced, but the cost increases

Engineering Contradiction:
Improvebacklight temperatureVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The heat radiation function is combined with the receiving member, which is already a necessary component of the backlight assembly. This integration eliminates the need to purchase, source, and install separate heat radiation members, thereby reducing manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The receiving member is designed to perform heat radiation functions autonomously without requiring additional specialized components. The integrated thermal management design allows the receiving member to serve both structural and thermal regulation functions, simplifying the manufacturing process and reducing costs.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the temperature of the light source unit, prolongs the lifespan of LEDs, and achieves improved heat radiation without increasing the size or weight of the backlight assembly, while maintaining cost-effectiveness.

Implementation Method 1

a plurality of through holes formed in a region of the receiving member where at least the light source unit is disposed

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

improving heat radiation from a light source unit

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

an uneven pattern formed on a second surface of the receiving member corresponding to the first surface of the receiving member on which at least the light source unit is disposed

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7850360B2Backlight assembly, liquid crystal display having the same, and method thereof
Publication Date: 2010.12.14 SAMSUNG DISPLAY CO LTD
  • US7850360B2 patent drawing
  • US7850360B2 patent drawing
  • US7850360B2 patent drawing

AI summary

The present invention relates to a backlight assembly and a liquid crystal display (“LCD”) having the same. The backlight assembly includes a light source unit including a printed circuit board (“PCB”) and a plurality of light emitting diodes (“LEDs”) mounted on a side of the PCB, a receiving member including a base plate and a plurality of walls that extend from the base plate at an angle and receive the light source unit, and a plurality of through holes or uneven patterns formed in a region of the receiving member where at least the light source unit is disposed.