Backlight Light Source Module With Reflective LED Chip Layout
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Solution Overview
Problem
Existing backlight units face challenges in achieving a slim structure while maintaining high luminous efficiency, particularly due to limitations in thickness reduction and heat dissipation associated with light emitting diode packaging.
Innovation Solution
The proposed solution involves a light source module with a light emitting diode chip mounted on a circuit board using flip-chip bonding or surface mount technology, accompanied by a wavelength conversion layer and a reflector covering the upper and side surfaces of the diode chip, which reflects light towards the exit surfaces to enhance luminous efficiency and reduce thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a light emitting diode package is mounted on a substrate and disposed inside the edge type backlight unit to reduce thickness, then the backlight unit achieves a slim structure, but packaging of the light emitting diode causes deterioration in heat dissipation
Solution Approach 1:
The patent extracts the light emitting diode from its traditional packaged form and mounts the bare LED chip directly on the substrate. This eliminates the packaging structure that trapped heat, allowing for direct thermal contact between the LED chip and the substrate's heat dissipation pathways while maintaining the slim profile.
Solution Approach 2:
The patent transitions from a vertically stacked packaged LED structure to a planar mounting configuration where the LED chip is disposed directly on the substrate surface. This dimensional change allows heat to dissipate laterally through the substrate rather than being confined vertically within a package.
2Reliability
If packaging of light emitting diode is used to protect the chip, then the LED is protected, but packaging causes limitation in thickness reduction of the backlight unit
Solution Approach 1:
The patent removes the traditional LED package structure entirely, exposing the LED chip directly. The chip is protected through direct mounting on the substrate with integrated heat dissipation structures, eliminating the need for a separate protective package that would increase thickness.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the LED chip, acts as a heat dissipation pathway, and integrates the mounting structure. This multi-functionality eliminates the need for separate protective packaging while maintaining structural integrity and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a slim structure with improved heat dissipation and high luminous efficiency, enabling the application of highly efficient light emitting diode chips in backlight units.
Implementation Method 1
a reflector structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source
Implementation Method 2
a wavelength conversion layer covering the light emitting device
Data Source
AI summary
A backlight unit includes one or more light sources operable to emit light and a light guide plate arranged adjacent to the one or more light sources, reflected lights exiting the one or more light sources via the second surfaces and entering the light guide plate. A light source includes a light emitting device having a substrate and a semiconductor stack disposed on the substrate. The reflector is structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source.