Backlight Light Source Module With Reflective Side Emission
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Solution Overview
Problem
Existing backlight units face challenges in achieving a slim structure while maintaining high luminous efficiency, particularly due to limitations in thickness reduction and heat dissipation associated with light emitting diode packaging.
Innovation Solution
The proposed solution involves a light source module with a light emitting diode chip mounted on a circuit board using flip-chip bonding or surface mount technology, accompanied by a wavelength conversion layer and a reflector covering the upper and side surfaces of the diode chip, which reflects light towards the exit surfaces to enhance luminous efficiency and reduce thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a light emitting diode package is mounted on a substrate and disposed inside the edge type backlight unit to reduce thickness, then the thickness of the backlight unit is reduced, but the heat dissipation deteriorates and packaging limitations prevent employment of highly efficient light emitting diode chips
Solution Approach 1:
The patent transitions from conventional top-emitting LED packages to bottom-emitting LED chips mounted on a substrate, fundamentally changing the light emission direction. This dimensional change allows the light to exit through the bottom surface of the substrate, enabling better thermal management and more efficient use of the LED chip structure while maintaining slim backlight unit profile
2Length of moving object
If conventional LED packaging is used to reduce thickness, then thickness reduction is achieved, but luminous efficiency deteriorates due to packaging limitations
Solution Approach 1:
The patent extracts the LED chip from its conventional package structure and mounts it directly on a substrate in a bare-chip configuration. This extraction eliminates the limitations of traditional packaging that hindered luminous efficiency, allowing direct mounting and optimization of the LED chip performance while achieving thickness reduction
Solution Approach 2:
The patent changes the operational parameters by using bottom-emitting LED chips with specific structural modifications. This parameter change enables the light to be emitted from the bottom surface, optimizing the optical path and luminous efficiency while facilitating better heat dissipation and thinner overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a slim structure with improved heat dissipation and high luminous efficiency, allowing for the application of highly efficient light emitting diode chips in backlight units.
Implementation Method 1
a reflector structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source
Data Source
AI summary
A backlight unit includes one or more light sources operable to emit light and a light guide plate arranged adjacent to the one or more light sources, reflected lights exiting the one or more light sources via the second surfaces and entering the light guide plate. A light source includes a light emitting device having a substrate and a semiconductor stack disposed on the substrate. The reflector is structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source.