Backlight Source Module Rubber Placement and Heat Dissipation
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Solution Overview
Problem
The design of backlight source modules with thin frames and high brightness is challenging due to warpage issues caused by the contraction of rubber in rubber-iron-integrated structures, leading to reduced yield and increased manufacturing costs, as well as poor heat dissipation which limits light-emitting power and brightness.
Innovation Solution
A backlight source module design that minimizes rubber usage by placing it only on the second side plate, incorporates a heat-conducting component between the light-emitting portion and the bottom plate for efficient heat dissipation, and uses a joggled connection between the light-guiding component and rubber member to enhance stability and prevent displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If rubber is integrated with the iron back plate structure, then the frame can be made thinner, but warpage occurs due to rubber contraction
Solution Approach 1:
The back plate structure is segmented into distinct functional zones: a first region without rubber for stability, and a second region with rubber for sealing. This segmentation allows the structure to achieve both thinness and flatness by isolating the rubber's contraction effects to a specific area.
Solution Approach 2:
Different regions of the back plate are assigned different qualities: the first region (without rubber) provides structural stability and flatness, while the second region (with rubber) provides sealing and flexibility. This local differentiation resolves the contradiction between thinness and stability.
2Reliability
If rubber is placed throughout the back plate, then sealing is improved, but warpage increases due to rubber contraction
Solution Approach 1:
The rubber member is segmented to occupy only a specific second region of the back plate, rather than being distributed throughout. This localized placement maintains sealing performance at critical areas while minimizing the overall contraction-induced warpage.
Solution Approach 2:
The rubber member is strategically placed in the second region where sealing is most needed, while the first region remains rubber-free to maintain structural flatness. This local quality differentiation optimizes both sealing and stability.
3Temperature
If heat-conducting component is added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat-conducting component is merged with the existing back plate structure, integrating thermal management functionality into the structural framework. This combination improves heat dissipation without significantly increasing overall device complexity.
Solution Approach 2:
The back plate structure serves multiple functions: structural support, sealing (via rubber), and heat conduction (via the heat-conducting component). This multi-functionality approach adds thermal management capability while minimizing additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces warpage, increases yield, enhances heat dissipation for higher light-emitting power, improves light utilization, and stabilizes the light-guiding component, resulting in a brighter and more reliable backlight source module with a narrower frame.
Implementation Method 1
incorporates a heat-conducting component between the light-emitting portion and the bottom plate for efficient heat dissipation
Data Source
AI summary
A backlight source module and a display device are provided. The backlight source module includes a back plate structure and a rubber member. The back plate structure includes a bottom plate, and a first side plate and a second side plate respectively connected with the bottom plate, and the first side plate and the second side plate oppose each other. A light-emitting portion, a light-guiding component and the rubber member are sequentially disposed on the bottom plate along a first direction pointing from the first side plate to the second side plate. The rubber member is only disposed at the second side plate.