Backlight Module Signal Layout Without Via Holes or Double Wiring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing glass-based Micro LED displays face challenges with high production costs and risks of short circuits due to the use of double metal wires in different layers for connecting driver chips and signal wires, which limits one-to-one connections.
Innovation Solution
A backlight module design featuring a light source module with light source units and a binding terminal unit where first signal wires are disposed in the same layer, connecting binding terminal parts one-to-one, and signal connection wires facilitate connections between adjacent signal wires, reducing the need for via holes and minimizing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If double metal wires in different layers are used to connect driver chips and signal wires, then connection flexibility is improved, but production cost increases and risk of short circuits increases
Solution Approach 1:
The patent transitions from three-dimensional multi-layer wiring to two-dimensional single-layer wiring. All signal wires are arranged in the same layer, eliminating the need for vertical connections via via holes. This dimensional simplification reduces manufacturing complexity and cost while maintaining connection flexibility through optimized lateral routing.
Solution Approach 2:
The patent extracts and eliminates the via hole structure from the wiring system. By removing the vertical connection component (via holes) that connected different metal layers, the design simplifies the manufacturing process and eliminates the associated risks of short circuits while preserving signal transmission functionality through in-plane routing.
2Adaptability or versatility
If double metal wires in different layers are used, then connection paths are increased, but risk of short circuits increases
Solution Approach 1:
The patent achieves multiple connection paths within the same layer through optimized routing arrangements. Signal wires are configured to extend in different directions and connect to different binding terminal parts, providing redundant pathways without requiring vertical layer transitions that could cause short circuits.
Solution Approach 2:
By removing via holes and multi-layer structures, the patent eliminates the interfaces where short circuits most commonly occur. The single-layer design with extended signal wires provides alternative routing paths that avoid the harmful vertical connections while maintaining system reliability.
3Adaptability or versatility
If via holes are used to connect different layers, then wiring flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces vertical wiring flexibility with horizontal wiring flexibility. Instead of using via holes to achieve three-dimensional routing flexibility, the design uses extended signal wires with multiple connection points in the same layer, achieving equivalent flexibility through two-dimensional routing.
Solution Approach 2:
The patent extracts and eliminates via holes from the manufacturing process. By removing this complex structural element, the design simplifies fabrication steps, reduces alignment requirements, and eliminates the need for multi-layer registration while maintaining wiring flexibility through in-plane signal wire extensions.
Data Source
AI summary
A backlight module includes a light source module, a binding terminal unit, a plurality of first signal wires disposed in a same layer and spaced apart, and a plurality of signal connection wires. The plurality of first signal wires are disposed to correspond to a plurality of binding terminal parts of the binding terminal unit one-to-one. Each of the first signal wires is configured to connect a first binding terminal of one of the binding terminal parts with one light source unit of the light source module. In adjacent two of binding terminal parts, one of the first signal wires corresponding to one of adjacent two of the binding terminal parts is connected to one of the first signal wires corresponding to another one of the adjacent two of the binding terminal parts through one of the signal connection wires.